SC2200UFH-300 AMD (ADVANCED MICRO DEVICES), SC2200UFH-300 Datasheet - Page 358

• Manufacturer Part Number: SC2200UFH-300
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of SC2200UFH-300

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

9.2
Table 9-15 describes the signal buffer types of the SC2200. See Table 3-2 "BGD432 Ball Assignment - Sorted by Ball Num-
ber" on page 29 and Table 3-2 "BGU481 Ball Assignment - Sorted by Ball Number" on page 29 for each signal’s buffer type.
The subsections that follow provide detailed DC characteristics according to buffer type.
Note 1.Output from these signals is open-drain and cannot be forced high.
376
Symbol
IN
OD
IN
O
Diode
IN
WIRE
IN
O
TS
IN
O
IN
IN
OD
O
IN
AC97
STRP
USB
USB
BTN
PCI
TS1
PCI
p/n
AB
TS
PCI
p/n
T
n
DC Characteristics
Description
Diodes only, no buffer
Input, ACCESS.bus compatible with Schmitt Trigger
Input, TTL compatible with Schmitt Trigger, low leakage
Input, PCI compatible
Input, Strap ball (min V
Input, TTL compatible
Input, TTL compatible with Schmitt Trigger type 200 mV
Input, with Schmitt Trigger type 200 mV
Input, USB compatible
Output, Totem-Pole, AC97 compatible
Output, Open-Drain, capable of sinking n mA (Note 1)
Output, Open-Drain, PCI compatible
Output, Totem-Pole, capable of sourcing p mA and sinking n mA
Output, PCI compatible, TRI-STATE
Output, USB compatible
Output, TRI-STATE, capable of sourcing p mA and sinking n mA
Wire, no buffer
32580B
IH
is 0.6V
Table 9-10. Buffer Types
IO
) with weak pull-down
AMD Geode™ SC2200 Processor Data Book
Section 9.2.10
Section 9.2.11
Section 9.2.12
Section 9.2.13
Section 9.2.14
Section 9.2.15
Electrical Specifications
Section 9.2.1
Section 9.2.2
Section 9.2.3
Section 9.2.4
Section 9.2.5
Section 9.2.6
Section 9.2.7
Section 9.2.8
Section 9.2.9
Reference
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