SC2200UFH-300 AMD (ADVANCED MICRO DEVICES), SC2200UFH-300 Datasheet - Page 369

• Manufacturer Part Number: SC2200UFH-300
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of SC2200UFH-300

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

Electrical Specifications
Note 1. Black level = Blank level = 0 mA, 0V.
Note 2. The maximum difference between the ideal (straight) conversion line and the actual conversion curve.
Note 3. The maximum difference between the ideal step size (1 LSB) and any actual step size.
Note 4. The input changes from 00h to FFh. The time from output voltage at 50% of step change to output settling (within
Note 5. The input changes from 00h to FFh. The output changes from 10% to 90%.
Note 6. AV
AMD Geode™ SC2200 Processor Data Book
Symbol
V
I
INL
DNL
t
t
DDM
C
PSRR
FR
ST
R
FR
OUT
an error of ±1 LSB) is the full-scale settling time.
PSSR is the ratio of the measurement of output at AV
CCRT
Parameter (Note 1)
Full range output voltage
Full range output current
Integral linearity error
Differential linearity error
Full-scale settling time
Rise time
DAC to DAC matching
Max output capacitance
Power supply rejection ratioNote 6
Table 9-15. CRT VESA Compatible DAC (RED, GREEN, and BLUE Outputs)
changes within the range of 3V to 3.6V. Output voltage is measured for peak-to-peak maximum change.
Min
CCRT
0.6
16
= 3.3V.
Max
0.72
19.2
3.5
±1
±1
10
15
4
5
Unit
LSB
LSB
mA
pF
ns
ns
%
%
V
32580B
Comments
SETRES = 470
R
Digital input = FFh
SETRES = 470
R
Digital input = FFh
Note 2
Note 3
CL = 40 pF, Note 4
Note 5
At 0 to 1 MHz
L
L
= 37.5
= 37.5
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