WG82574L S LBA8 Intel, WG82574L S LBA8 Datasheet - Page 459

• Manufacturer Part Number: WG82574L S LBA8
• Manufacturer: Intel

Specifications of WG82574L S LBA8

• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / RoHS Status: Compliant

Thermal Design Considerations—82574 GbE Controller
14.14
Note:
PCB Guidelines
The following general PCB design guidelines are recommended to maximize the thermal
performance of QFN packages:
The previously mentioned guidelines are not all inclusive and are defined to give
known, good design practices to maximize the thermal performance of the
components.
1. When connecting ground (thermal) vias-to the ground planes, do not use thermal-
2. Thermal-relief patterns are designed to limit heat transfer between the vias and the
3. As board temperature also has an effect on the thermal performance of the
4. If airflow exists, locate the components in the mainstream of the airflow path for
relief patterns.
copper planes, thus constricting the heat flow path from the component to the
ground planes in the PCB.
package, avoid placing 82574 adjacent to high power dissipation devices.
maximum thermal performance. Avoid placing the components downstream,
behind larger devices or devices with heat sinks that obstruct the air flow or supply
excessively heated air.
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