LU82551ER 860613 Intel, LU82551ER 860613 Datasheet - Page 98

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LU82551ER 860613

Manufacturer Part Number
LU82551ER 860613
Description
Manufacturer
Intel
Datasheet

Specifications of LU82551ER 860613

Lead Free Status / Rohs Status
Supplier Unconfirmed
82551ER — Networking Silicon
90
Figure 29. 196 PBGA Package Pad Detail
As illustrated in
is 0.60 mm and the opening in the solder mask is 0.45 mm. The nominal ball sphere diameter is
0.50 mm.
0.45
Solder Resist Opening
Figure
0.60
Metal Diameter
29, the 82551ER package uses solder mask defined pads. The copper area
Detail Area
Datasheet

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