EP1S10F672C7 Altera, EP1S10F672C7 Datasheet - Page 18
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EP1S10F672C7
Manufacturer Part Number
EP1S10F672C7
Description
IC STRATIX FPGA 10K LE 672-FBGA
Manufacturer
Altera
Series
Stratix®r
Datasheet
1.EP1S10F780C7.pdf
(276 pages)
Specifications of EP1S10F672C7
Number Of Logic Elements/cells
10570
Number Of Labs/clbs
1057
Total Ram Bits
920448
Number Of I /o
345
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
672-FBGA
Family Name
Stratix
Number Of Logic Blocks/elements
10570
# I/os (max)
345
Frequency (max)
420.17MHz
Process Technology
0.13um (CMOS)
Operating Supply Voltage (typ)
1.5V
Logic Cells
10570
Ram Bits
920448
Operating Supply Voltage (min)
1.425V
Operating Supply Voltage (max)
1.575V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
672
Package Type
FBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Not Compliant
Other names
544-1109
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EP1S10F672C7
Manufacturer:
ALTERA
Quantity:
3 000
Part Number:
EP1S10F672C7
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Company:
Part Number:
EP1S10F672C7AA
Manufacturer:
ALTERA
Quantity:
3 000
Company:
Part Number:
EP1S10F672C7ES
Manufacturer:
ALTERA
Quantity:
89
Company:
Part Number:
EP1S10F672C7N
Manufacturer:
ALTERA
Quantity:
3 000
Part Number:
EP1S10F672C7N
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
Logic Array Blocks
Figure 2–2. Stratix LAB Structure
2–4
Stratix Device Handbook, Volume 1
Direct link
interconnect from
adjacent block
Direct link
interconnect to
adjacent block
Local Interconnect
LAB Interconnects
The LAB local interconnect can drive LEs within the same LAB. The LAB
local interconnect is driven by column and row interconnects and LE
outputs within the same LAB. Neighboring LABs, M512 RAM blocks,
M4K RAM blocks, or DSP blocks from the left and right can also drive an
LAB’s local interconnect through the direct link connection. The direct
link connection feature minimizes the use of row and column
interconnects, providing higher performance and flexibility. Each LE can
drive 30 other LEs through fast local and direct link interconnects.
Figure 2–3
LAB
shows the direct link connection.
Three-Sided Architecture—Local
Interconnect is Driven from Either Side by
Columns & LABs, & from Above by Rows
Row Interconnects of
Variable Speed & Length
Column Interconnects of
Variable Speed & Length
Altera Corporation
Direct link
interconnect from
adjacent block
Direct link
interconnect to
adjacent block
July 2005