ISP1583BSUM ST-Ericsson Inc, ISP1583BSUM Datasheet - Page 91
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ISP1583BSUM
Manufacturer Part Number
ISP1583BSUM
Description
IC USB PERIPH CONTROLLER 64HVQFN
Manufacturer
ST-Ericsson Inc
Datasheet
1.ISP1583BSUM.pdf
(100 pages)
Specifications of ISP1583BSUM
Controller Type
USB Peripheral Controller
Interface
Parallel/Serial
Voltage - Supply
3 V ~ 3.6 V
Current - Supply
47mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
64-VQFN Exposed Pad, 64-HVQFN, 64-SQFN, 64-DHVQFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-1886-2
ISP1583BS,518
ISP1583BS-T
ISP1583BS,518
ISP1583BS-T
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ISP1583BSUM
Manufacturer:
MICRON
Quantity:
2 000
Company:
Part Number:
ISP1583BSUM
Manufacturer:
ST-ERICS
Quantity:
829
Part Number:
ISP1583BSUM
Manufacturer:
STE
Quantity:
20 000
NXP Semiconductors
ISP1583_7
Product data sheet
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 111. SnPb eutectic process (from J-STD-020C)
Table 112. Lead-free process (from J-STD-020C)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 111
and
Figure
112
Rev. 07 — 22 September 2008
42.
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
Hi-Speed USB peripheral controller
42) than a SnPb process, thus
220
220
350
> 2000
260
245
245
© NXP B.V. 2008. All rights reserved.
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