ELLXT971ABE.A4 Intel, ELLXT971ABE.A4 Datasheet - Page 105

• Manufacturer Part Number: ELLXT971ABE.A4
• Description: IC TRANS 3.3V ETHERNET 64-BGA
• Manufacturer: Intel
• Type: PHY Transceiverr

Specifications of ELLXT971ABE.A4

• Number Of Drivers/receivers: 1/1
• Protocol: IEEE 802
• Voltage - Supply: 3.14 V ~ 3.45 V
• Mounting Type: Surface Mount
• Package / Case: 64-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 870479

10.0
Datasheet
Document Number: 249414-003
Revision Date: June 18, 2004
Figure 43. Intel
1.26 ± 0.10
Part Number LXT971ABC - Commercial Temperature Range (0ºC to +70ºC)
Part Number LXT971ABE - Extended Temperature Range (-40ºC to +85ºC)
NOTE: The package figure is generic and used only to demonstrate package dimensions. (The figure does not
0.70 ± 0.025
0.26 ± 0.04
show the same number of pins as for the Intel
Intel
0.28 ± 0.10
0.20 (4X)
®
LXT971A Transceiver PBGA Package Specification
®
2.00 REF.
OPTION:
PIN A1 IDENTIFIER
1.00 ± 0.10
INK OR LASER MARKING
64-Ball Plastic Ball Grid Array Package
LXT971A Transceiver Package Specifications
7.00 ± 0.20
SIDE VIEW
TOP VIEW
Intel
B
®
LXT971A Single-Port 10/100 Mbps PHY Transceiver
NOTES:
1. All dimensions and tolerances conform to ASME Y 14.5 M - 1994.
2. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
3. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
4. Maximum mold to substrate offset shall be 0.127.
5. The surface finish of the package shall be EDM Charmille #18 - #21.
6. Unless otherwise specified tolerance: Decimal ± 0.05 Angular ±2°.
SEATING PLANE
®
LXT971A Transceiver PBGA.)
3
0.70 REF.
G
A
B
C
D
E
F
H
8
7
C
6
5
6.30
0.40 ± 0.15
4
0.80
BOTTOM VIEW
3
2
2
1
0.30
0.15
C
C
B
105
A