TE28F800C3TA110 Micron Technology Inc, TE28F800C3TA110 Datasheet - Page 16
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TE28F800C3TA110
Manufacturer Part Number
TE28F800C3TA110
Description
Manufacturer
Micron Technology Inc
Datasheet
1.TE28F800C3TA110.pdf
(70 pages)
Specifications of TE28F800C3TA110
Density
8Mb
Access Time (max)
110ns
Interface Type
Parallel
Boot Type
Top
Address Bus
19b
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
16b
Number Of Words
512K
Supply Current
18mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TE28F800C3TA110
Manufacturer:
TI
Quantity:
201
4.0
4.1
Figure 5:
Datasheet
16
64 M
32 M
16 M
48-Lead TSOP Package
Ballout and Signal Descriptions
The C3 device is available in 48-lead TSOP, 48-ball VF BGA, 48-ball μBGA, and Easy
BGA packages. See
page
48-Lead TSOP Package
A
A
A
A
A
A
A
A
A
A
WE#
RP#
V
WP#
A
A
A
A
A
A
A
A
A
A
15
14
13
12
11
10
9
8
21
20
PP
19
18
17
7
6
5
4
3
2
1
19, respectively.
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
1
2
3
4
5
6
7
8
9
Figure 5 on page
Advanced+ Boot Block
12 mm x 20 mm
48-Lead TSOP
TOP VIEW
16,
Figure 7 on page
18, and
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
Figure 8 on
A
V
GND
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
V
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
OE#
GND
CE#
A
0
16
CCQ
CC
15
7
14
6
13
5
12
4
11
3
10
2
9
1
8
0
C3 Discrete
March 2008
290645-24