TE28F800C3TA110 Micron Technology Inc, TE28F800C3TA110 Datasheet - Page 5
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TE28F800C3TA110
Manufacturer Part Number
TE28F800C3TA110
Description
Manufacturer
Micron Technology Inc
Datasheet
1.TE28F800C3TA110.pdf
(70 pages)
Specifications of TE28F800C3TA110
Density
8Mb
Access Time (max)
110ns
Interface Type
Parallel
Boot Type
Top
Address Bus
19b
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
16b
Number Of Words
512K
Supply Current
18mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TE28F800C3TA110
Manufacturer:
TI
Quantity:
201
C3 Discrete
Revision History
March 2008
290645-24
Revision
05/12/98
07/21/98
10/03/98
12/04/98
12/31/98
02/24/99
06/10/99
03/20/00
04/24/00
10/12/00
10/02/01
Date of
7/20/01
2/05/02
4/05/02
3/06/03
Version
-001
-002
-003
-004
-005
-006
-007
-008
-009
-010
-011
-012
-013
-014
-016
Original version
48-Lead TSOP package diagram change
μBGA package diagrams change
32-Mbit ordering information change (Section 6)
CFI Query Structure Output Table Change (Table C2)
CFI Primary-Vendor Specific Extended Query Table Change for Optional Features and
Command Support change (Table C8)
Protection Register Address Change
I
μBGA package top side mark information clarification (Section 6)
Byte-Wide Protection Register Address change
V
V
I
Added Command Sequence Error Note (Table 7)
Datasheet renamed from 3 Volt Advanced Boot Block, 8-, 16-, 32-Mbit Flash Memory
Family.
Added t
Programming the Protection Register clarification (Section 3.4.2)
Removed all references to x8 configurations
Removed reference to 40-Lead TSOP from front page
Added Easy BGA package (Section 1.2)
Removed 1.8 V I/O references
Locking Operations Flowchart changed (Appendix B)
Added t
CFI Primary Vendor-Specific Extended Query changed (Appendix C)
Max I
Table 10, added note indicating V
Added specifications for 0.18 micron product offerings throughout document Added 64-
Mbit density
Changed references of 32Mbit 80ns devices to 70ns devices to reflect the faster product
offering.
Changed VccMax=3.3V reference to indicate that the affected product is the 0.25μm
32Mbit device.
Minor text edits throughout document.
Added 1.8v I/O operation documentation where applicable
Added TSOP PCN ‘Pin-1’ indicator information
Changed references in 8 x 8 BGA pinout diagrams from ‘GND’ to ‘Vssq’
Added ‘Vssq’ to Pin Descriptions Information
Removed 0.4 µm references in DC characteristics table
Corrected 64Mb package Ordering Information from 48-uBGA to 48-VFBGA
Corrected ‘bottom’ parameter block sizes to on 8Mb device to 8 x 4KWords
Minor text edits throughout document
Added specifications for 0.13 micron product offerings throughout document
Corrected Iccw / Ippw / Icces /Ippes values.
Added mechanicals for 16Mb and 64Mb
Minor text edits throughout document.
Updated 64Mb product offerings.
Updated 16Mb product offerings.
Revised and corrected DC Characteristics Table.
Added mechanicals for Easy BGA.
Minor text edits throughout document.
Complete technical update.
PPD
CCS
IH
IL
Maximum Specification change (Section 4.3)
Specification change (Section 4.3)
test conditions clarification (Section 4.3)
test conditions clarification (Section 4.3)
CCD
BHWH
WHGL
changed to 25 µA
/t
(Section 4.6)
BHEH
and t
QVBL
(Section 4.6)
CC
Max = 3.3 V for 32-Mbit device
Description
Datasheet
5