ADP8860 Analog Devices, ADP8860 Datasheet - Page 6

• Manufacturer Part Number: ADP8860
• Description: Charge Pump, 7-Channel Smart LED Driver with I2C Interface
• Manufacturer: Analog Devices

Specifications of ADP8860

• Vin Range: 2.4V to 5.5V
• Vout (v): 4.3 to 5.5
• Synchronous: No
• Package: 20-Lead WLCSP
• Led Configuration: Parallel
• Topology: Capacitive
• I2c Support: Yes
• Max Iout (ma): 60mA
• Brightness Control: I2C
• Peak Efficiency (%): 89%
• Switching Frequency: 1MHz

ADP8860
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VIN, VOUT
D1, D2, D3, D4, D5, D6, and D7
CMP_IN
nINT, nRST, SCL, and SDA
Output Short-Circuit Duration
Operating Ambient Temperature Range
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
ESD (Electrostatic Discharge)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all voltages are
referenced to GND.
MAXIMUM TEMPERATURE RANGES
The maximum operating junction temperature (T
supersedes the maximum operating ambient temperature
(T
exposed to poor thermal resistance and a high power
dissipation (P
to be derated. In these cases, the ambient temperature
maximum can be calculated with the following equation:
The maximum operating junction temperature (T
maximum operating ambient temperature (T
Temperature Ranges section for more information.
Human Body Model (HBM)
Charged Device Model (CDM)
A(MAX)
T
A(MAX)
). Therefore, in situations where the ADP8860 is
= T
D
), the maximum ambient temperature may need
J(MAX)
− (θ
JA
× P
D(MAX)
)
A(MAX)
J(MAX)
). See the Maximum
) supersedes the
Rating
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +6 V
Indefinite
–40°C to +85°C
–40°C to +125°C
–65°C to +150°C
JEDEC J-STD-020
±2 kV
±2 kV
J(MAX)
)
1
Rev. 0 | Page 6 of 52
THERMAL RESISTANCE
θ
that is, a device soldered in a circuit board for surface-mount
packages. The θ
case) are determined according to JESD51-9 on a 4-layer
printed circuit board (PCB) with natural convection cooling.
For the LFCSP package, the exposed pad must be soldered to
the GND1 and/or GND2 terminal(s) on the board.
Table 3. Thermal Resistance
Package Type
WLCSP
LFCSP_VQ
1
ESD CAUTION
N/A means not applicable.
JA
(junction to air) is specified for the worst-case conditions,
JA
, θ
θ
48
49.5
JB
JA
(junction to board), and θ
θ
9
N/A
1
JB
θ
N/A
5.3
JC
JC
(junction to
Unit
°C/W
°C/W