LPC1343FHN33 NXP Semiconductors, LPC1343FHN33 Datasheet - Page 67

• Manufacturer Part Number: LPC1343FHN33
• Description: The LPC1343FHN33 is a ARM Cortex-M3 based microcontroller for embedded applications featuring a high level of integration and low power consumption
• Manufacturer: NXP Semiconductors

NXP Semiconductors
LPC1311_13_42_43
Product data sheet
Fig 41. Reflow soldering of the HVQFN33 package
Footprint information for reflow soldering of HVQFN33 package
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
All information provided in this document is subject to legal disclaimers.
SPD = 1.00 SP
Rev. 4 — 20 June 2011
0.20 SR
chamfer (4×)
PID = 7.25 PA+OA
OwDtot = 5.10 OA
SDhtot = 2.70 SP
OID = 8.20 OA
DHS = 4.85 CU
LbD = 5.80 CU
LaD = 7.95 CU
evia = 4.25
evia = 2.40
4.55 SR
Remark:
Stencil thickness: 0.125 mm
GapD = 0.70 SP
e = 0.65
32-bit ARM Cortex-M3 microcontroller
W = 0.30 CU
0.45 DM
LPC1311/13/42/43
(A-side fully covered)
number of vias: 20
B-side
© NXP B.V. 2011. All rights reserved.
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
001aao134
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