TMP91xy25FG Toshiba, TMP91xy25FG Datasheet - Page 223
![no-image](/images/manufacturer_photos/0/6/668/toshiba_sml.jpg)
TMP91xy25FG
Manufacturer Part Number
TMP91xy25FG
Description
Manufacturer
Toshiba
Datasheet
1.TMP91XY25FG.pdf
(260 pages)
Specifications of TMP91xy25FG
Package
LQFP100
Rom Types(m=mask,p=otp, F=flash,e=eeprom)
Romless
Rom Combinations
Romless
Ram Combinations
Ramless
Architecture
16-bit CISC
Usb/spi Channels
-
Uart/sio Channels
2
I2c/sio Bus Channels
-
(s)dram Controller
-
Adc 10-bit Channel
4
Da Converter
-
Timer 8-bit Channel
4
Timer 16-bit Channel
-
Pwm 8-bit Channels
-
Pwm 16-bit Channels
-
Cs/wait Controller
4
Dual Clock
Y
Number Of I/o Ports
49
Power Supply Voltage(v)
3.0 to 3.6
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4.
4.1
Note: The absolute maximum ratings are rated values which must not be exceeded during operation,
Electrical Characteristics
parameter
Solderability
Absolute Maximum Ratings
Solderability of lead lead-free products
Test
even for an instant. Any one of the ratings must not be exceeded. If any absolute maximum rating
is exceeded, the device may break down or its performance may be degraded, causing it to catch
fire or explode resulting in injury to the user. Thus, when designing products which include this
device, ensure that no absolute maximum rating value will ever be exceeded.
Power supply voltage
Input voltage
Output current
Output Current (MX, MY pin)
Output current
Output Current (PX, PY pin)
Output current (Total)
Output current (Total)
Power dissipation (Ta = 85°C)
Soldering temperature (10 s)
Storage temperature
Operating temperature
(1) Use of Sn-637Pb solder Bath
(2) Use of Sn-3.0Ag-0.5Cu solder bath
Solder bath temperature =230°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Solder bath temperature =245°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux (use of lead lead-free)
Parameter
Test condition
TSOLDER
Symbol
91C025-222
TOPR
TSTG
ΣIOH
ΣIOL
IOH
IOH
Vcc
VIN
IOL
IOL
PD
−0.5 to Vcc + 0.5
−0.5 to 4.0
−65 to 150
−40 to 85
Rating
−15
−80
600
260
15
−2
80
2
Pass:
solderability rate until forming ≥ 95%
Unit
mW
mA
mA
mA
mA
mA
mA
°C
°C
°C
V
V
Note
TMP91C025
2007-02-28
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