FAN3111E Fairchild Semiconductor, FAN3111E Datasheet - Page 2
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FAN3111E
Manufacturer Part Number
FAN3111E
Description
The FAN3111 1A gate driver is designed to drive an N-channel enhancement-mode MOSFET in low-side switching applications
Manufacturer
Fairchild Semiconductor
Datasheet
1.FAN3111E.pdf
(18 pages)
Available stocks
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Manufacturer
Quantity
Price
Company:
Part Number:
FAN3111ESX
Manufacturer:
FSC
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Part Number:
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© 2008 Fairchild Semiconductor Corporation
FAN3111 • Rev. 1.0.2
Ordering Information
Thermal Characteristics
5-Pin SOT23
Notes:
1.
2.
3.
4.
5.
6.
Pin Definitions
Output Logic with Dual-Input Configuration
Note:
7.
Pin #
1
2
3
4
5
Part Number
Estimates derived from thermal simulation; actual values depend on the application.
Theta_JL (
(including any thermal pad) that are typically soldered to a PCB.
Theta_JT (
assuming it is held at a uniform temperature by a top-side heatsink.
Theta_JA (Θ
and airflow. The value given is for natural convection with no heatsink using a 2S2P board,, as specified in
JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate.
Psi_JB (
temperature and an application circuit board reference point for the thermal environment defined in Note 4. For
the MLP-8 package, the board reference is defined as the PCB copper connected to the thermal pad and
protruding from either end of the package. For the SOIC-8 package, the board reference is defined as the PCB
copper adjacent to pin 6.
Psi_JT (
temperature and the center of the top of the package for the thermal environment defined in Note 4.
Default input signal if no external connection is made.
FAN3111CSX
FAN3111ESX
Name
XREF
VDD
GND
OUT
IN+
IN–
JT
JB
): Thermal characterization parameter providing correlation between the semiconductor junction
): Thermal characterization parameter providing correlation between semiconductor junction
IN+
0
0
JL
JT
JA
1
1
(7)
(7)
): Thermal resistance between the semiconductor junction and the bottom surface of all the leads
): Thermal resistance between the semiconductor junction and the top surface of the package,
): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking,
Description
Supply Voltage. Provides power to the IC.
Ground. Common ground reference for input and output circuits.
Non-Inverting Input. Connect to VDD to enable output.
FAN3111C Inverting Input. Connect to GND to enable output.
FAN3111E External Reference Voltage. Reference for input thresholds, 2V to 5V.
Gate Drive Output. Held low unless required inputs are present.
Package
Threshold
External
CMOS
Input
(1)
5-Pin SOT23
5-Pin SOT23
Package
IN−
1
1
0
0
(7)
(7)
2
JL
58
(2)
Packing Method
Tape & Reel
Tape & Reel
102
JT
(3)
161
JA
(4)
JB
53
OUT
(5)
0
0
1
0
Quantity per
JT
3,000
3,000
6
Reel
www.fairchildsemi.com
(6)
Units
°C/W