BFR840L3RHESD Infineon Technologies, BFR840L3RHESD Datasheet - Page 26

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BFR840L3RHESD

Manufacturer Part Number
BFR840L3RHESD
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of BFR840L3RHESD

Packages
TSLP-3-9
Vceo (max)
2.25 V
Ic(max)
35.0 mA
Nfmin (typ)
-
Gmax (typ)
-
Oip3
-
6
Figure 22
Figure 23
Figure 24
Figure 25
Data Sheet
Package Information TSLP-3-9
Package Outline
Package Foot Print
Marking Example (Marking BFR840L3RHESD: T8)
Tape Dimensions
Pin 1
marking
1) Dimension applies to plated terminal
0.225
Top view
Pin 1
marking
0.15
Copper
0.6
0.225
Solder mask
0.31
4
+0.01
-0.02
26
0.8
0.5
2 x 0.15
0.35
±0.035
R0.19
±0.05
±0.035
Bottom view
0.2
1)
3
2
0.17
0.6
Stencil apertures
TSLP-3-9-TP V02
0.2
1)
±0.05
0.5
0.35
1
TSLP-3-9-FP V01
TSLP-3-9-PO V01
R0.1
Package Information TSLP-3-9
Revision 1.0, 2012-04-19
BFR840L3RHESD

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