DSPIC30F3011 Microchip Technology Inc., DSPIC30F3011 Datasheet - Page 203
DSPIC30F3011
Manufacturer Part Number
DSPIC30F3011
Description
Dspic30f3010/3011 Enhanced Flash 16-bit Digital Signal Controller
Manufacturer
Microchip Technology Inc.
Datasheet
1.DSPIC30F3011.pdf
(220 pages)
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24.2
© 2007 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Package Details
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Dimension Limits
Confidential
Units
A2
A1
E1
eB
b1
N
A
E
D
e
L
c
b
e
1.345
dsPIC30F3010/3011
MIN
.120
.015
.290
.240
.110
.008
.040
.014
A2
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.135
.310
.285
.130
.010
.050
.018
28
–
–
–
Microchip Technology Drawing C04-070B
eB
E
1.400
MAX
.200
.335
.070
.022
.430
.150
.295
.150
.015
–
DS70141D-page 201
c