mpc8568e Freescale Semiconductor, Inc, mpc8568e Datasheet - Page 126

• Manufacturer Part Number: mpc8568e
• Description: Mpc8568e Powerquicc Iii Processor
• Manufacturer: Freescale Semiconductor, Inc

Thermal
system-level design—the heat sink, airflow, and thermal interface material. The recommended attachment
method to the heat sink is illustrated in
board with the spring force centered over the die. This spring force should not exceed 10 pounds force.
The system board designer can choose between several types of heat sinks to place on the device. There
are several commercially-available heat sinks from the following vendors:
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several
heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha Novatech, IERC, and
126
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Advanced Thermal Solutions
89 Access Road #27.
Norwood, MA02062
Internet: www.qats.com
Alpha Novatech
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-millennium.com
MPC8568E/MPC8567E PowerQUICC III™ Integrated Processor Hardware Specifications, Rev. 0
Figure 69. Package Exploded Cross-Sectional View with Several Heat Sink Options
Thermal Interface Material
Printed-Circuit Board
Heat Sink
Heat Sink
Figure
Clip
Die
69. The heat sink should be attached to the printed-circuit
FC-PBGA Package
781-769-2800
603-224-9988
408-749-7601
818-842-7277
408-436-8770
Freescale Semiconductor