ppc440gp-3rc500cz Applied Micro Circuits Corporation (AMCC), ppc440gp-3rc500cz Datasheet - Page 56

• Manufacturer Part Number: ppc440gp-3rc500cz
• Description: Power Pc 440gp Embedded Processor
• Manufacturer: Applied Micro Circuits Corporation (AMCC)

440GP – Power PC 440GP Embedded Processor
56
Package Thermal Specifications
Thermal resistance values for the CBGA and PBGA packages in a convection environment are as follows:
Junction-to-case thermal resistance
Case-to-ambient thermal resistance (w/o heat
sink)
Junction-to-ball (typical)
Notes:
1. Case temperature, T
2. The case-to-ambient thermal resistance is measured in a JEDEC JESD51-6 standard environment; and may not accurately predict
3. Modeled on standard JEDEC 2S2P card, 50x50mm
thermal performance in production equipment environments. The operational case temperature must be maintained.
Parameter
C
, is measured at top center of case surface with device soldered to circuit board.
Symbol
θ
θ
θ
CA
JC
JB
Ceramic
Plastic
Ceramic
Plastic
Ceramic
Plastic
Package
0 (0)
<0.1
18.9
1.2
ft/min (m/sec)
100 (0.51)
Airflow
<0.1
17.7
20.8
1.2
8.0
Revision 1.08 – April 3, 2008
200 (1.02)
<0.1
16.3
1.2
Data Sheet
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
1, 3
2, 3
AMCC
1
2
3