ST72F63 STMICROELECTRONICS [STMicroelectronics], ST72F63 Datasheet - Page 123

• Manufacturer Part Number: ST72F63
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

14.3 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only
as design guidelines in
Figure 82. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
Figure 83. Recommended Reflow Soldering Oven Profile (MID JEDEC)
Temp. [°C]
Temp. [°C]
250
200
150
100
250
200
150
100
50
50
0
0
PREHEATING
PHASE
Figure 82
ramp up
2°C/sec for 50sec
20
90 sec at 125°C
80°C
and
100
40
Figure
SOLDERING
PHASE
83.
60
5 sec
200
150 sec above 183°C
80
Recommended glue for SMD plastic packages
dedicated to molding compound with silicone:
Heraeus: PD945, PD955
Loctite: 3615, 3298
100
ramp down natural
2°C/sec max
COOLING PHASE
(ROOM TEMPERATURE)
Tmax=220+/-5°C
for 25 sec
300
120
140
400
160
Time [sec]
Time [sec]
ST7263B
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