PF38F5070M0Y0T0 NUMONYX [Numonyx B.V], PF38F5070M0Y0T0 Datasheet - Page 35
PF38F5070M0Y0T0
Manufacturer Part Number
PF38F5070M0Y0T0
Description
Numonyx StrataFlash Wireless Memory
Manufacturer
NUMONYX [Numonyx B.V]
Datasheet
1.PF38F5070M0Y0T0.pdf
(98 pages)
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Numonyx™ StrataFlash
8.4
November 2007
Order Number: 313295-04
When the device is accessed, many internal conditions change. Circuits within the
device enable charge-pumps, and internal logic states change at high speed. All of
these internal activities produce transient signals. Transient current magnitudes depend
on the device outputs’ capacitive and inductive loading. Two-line control and correct
decoupling capacitor selection suppress transient voltage peaks.
Because Intel
VCC, VPP, and VCCQ, each power connection should have a 0.1 µF ceramic capacitor
connected to a corresponding ground connection (e.g.VCCQ to VSSQ). High-frequency,
inherently low-inductance capacitors should be placed as close as possible to package
leads.
Additionally, for every eight devices used in the system, a 4.7 µF electrolytic capacitor
should be placed between power and ground close to the devices. The bulk capacitor is
meant to overcome voltage droop caused by PCB trace inductance.
Automatic Power Saving (APS)
Automatic Power Saving (APS) provides low power operation during a read’s active
state. I
CE# is deasserted. During APS, average current is measured over the same time
interval 5 μs after the following events happen: (1) there is no internal read, program
or erase operations cease; (2) CE# is asserted; (3) the address lines are quiescent and
at V
SSQ
®
CCAPS
Wireless Memory (L18 AD-Mux)
or V
CCQ
is the average current measured over any 5 ms time interval, 5 μs after
®
. OE# may also be driven during APS.
Multi-Level Cell (MLC) flash memory devices draw their power from
Datasheet
35
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