PIC18F1220 MICROCHIP [Microchip Technology], PIC18F1220 Datasheet - Page 293

• Manufacturer Part Number: PIC18F1220
• Description: 18/20/28-Pin High-Performance, Enhanced Flash Microcontrollers with 10-bit A/D and nanoWatt Technology
• Manufacturer: MICROCHIP [Microchip Technology]

28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Punch Singulated (QFN)
 2004 Microchip Technology Inc.
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Width
Molded Package Width
Exposed Pad Width
Overall Length
Molded Package Length
Exposed Pad Length
Lead Width
Lead Length
Tie Bar Width
Tie Bar Length
Chamfer
Mold Draft Angle Top
Drawing No. C04-114
A1
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: MO-220
CH X 45°
ı
α
TOP VIEW
Dimension Limits
E1
E
Units
CH
A2
A1
A3
E1
E2
D1
D2
n
ı α
D
R
Q
n
p
A
E
B
L
2
1
MIN
A2
D1
.000
.140
.140
.009
.020
.005
.012
.009
A3
D
A
INCHES
.026 BSC
.236 BSC
.226 BSC
.236 BSC
.226 BSC
.008 REF
NOM
.0004
.033
.026
.146
.146
.011
.024
.007
.016
.017
D2
28
R
MAX
EXPOSED
.039
.031
.002
.152
.152
.014
.030
.010
.026
.024
PIC18F1220/1320
12°
METAL
PAD
BOTTOM VIEW
MIN
E2
0.00
3.55
3.55
0.23
0.50
0.13
0.30
0.24
MILLIMETERS*
0.65 BSC
6.00 BSC
5.75 BSC
6.00 BSC
5.75 BSC
0.20 REF
NOM
0.85
0.65
0.01
3.70
3.70
0.28
0.60
0.17
0.40
0.42
L
28
DS39605C-page 291
MAX
Q
B
1.00
0.80
0.05
3.85
3.85
0.35
0.75
0.23
0.65
0.60
p
12°