HYB18L128160BC-7.5 QIMONDA [Qimonda AG], HYB18L128160BC-7.5 Datasheet - Page 5

• Manufacturer Part Number: HYB18L128160BC-7.5
• Description: DRAMs for Mobile Applications 128-Mbit Mobile-RAM
• Manufacturer: QIMONDA [Qimonda AG]

HY[B/E]18L128160B[C/F]-7.5
128-Mbit Mobile-RAM
OverviewDescription
1.3
Description
The HY[B/E]18L128160B[C/F] is a high-speed CMOS, dynamic random-access memory containing 134,217,728
bits. It is internally configured as a quad-bank DRAM.
The HY[B/E]18L128160B[C/F] achieves high speed data transfer rates by employing a chip architecture that
prefetches multiple bits and then synchronizes the output data to the system clock. Read and write accesses are
burst-oriented; accesses start at a selected location and continue for a programmed number of locations (1, 2, 4,
8 or full page) in a programmed sequence.
The device operation is fully synchronous: all inputs are registered at the positive edge of CLK.
The HY[B/E]18L128160B[C/F] is especially designed for mobile applications. It operates from a 1.8V power
supply. Power consumption in self refresh mode is drastically reduced by an On-Chip Temperature Sensor
(OCTS); it can further be reduced by using the programmable Partial Array Self Refresh (PASR).
A conventional data-retaining Power-Down (PD) mode is available as well as a non-data-retaining Deep Power-
Down (DPD) mode.
The HY[B/E]18L128160B[C/F] is housed in a 54-ball P-VFBGA package. It is available in Commercial (0 °C to
70 °C) and Extended (-25 °C to +85 °C) temperature range.
Data Sheet
5
Rev. 1.71, 2007-01
05282004-NZNK-8T0D