STM32F101X6_08 STMICROELECTRONICS [STMicroelectronics], STM32F101X6_08 Datasheet - Page 64

• Manufacturer Part Number: STM32F101X6_08
• Description: Access line, advanced ARM-based 32-bit MCU with Flash memory, six 16-bit timers, ADC and seven communication interfaces
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Package characteristics
1. Drawing is not to scale.
2. The back-side pad is not internally connected to the V
3. There is an exposed die pad on the underside of the VFQFPN package. It should be soldered to the PCB. All leads should
Table 46.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
64/74
Figure 31. VFQFPN36 6 x 6 mm, 0.5 mm pitch,
A
A1
A2
A3
b
D
D2
E
E2
e
L
ddd
Seating plane
also be soldered to the PCB.
E2
Symbol
C
A3
b
27
19
18
VFQFPN36 6 x 6 mm, 0.5 mm pitch, package mechanical data
package outline
28
e
0.800
0.180
5.875
1.750
5.875
1.750
0.450
0.350
Min
D2
D
36
10
(1)
L
millimeters
1
9
A1
E
0.020
0.650
0.250
3.700
0.900
0.230
6.000
3.700
6.000
0.500
0.550
0.080
Typ
A2
A
Pin # 1 ID
R = 0.20
ddd C
ZR_ME
SS
or V
1.000
0.050
1.000
0.300
6.125
4.250
6.125
4.250
0.550
0.750
Max
DD
Figure 32. Recommended footprint
power pads.
6.30
0.30
0.75
9
1
0.0315
0.0071
0.2313
0.0689
0.2313
0.0689
0.0177
0.0138
Min
(dimensions in mm)
10
36
4.80
4.80
4.10
4.30
4.30
inches
0.0354
0.0008
0.0256
0.0098
0.0091
0.2362
0.1457
0.2362
0.1457
0.0197
0.0217
0.0031
0.50
Typ
4.10
(1)
(1)(2)(3)
18
STM32F101xx
19
27
1.00
0.0394
0.0020
0.0394
0.0118
0.2411
0.1673
0.2411
0.1673
0.0217
0.0295
4.30
Max
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