STM32F101X6_08 STMICROELECTRONICS [STMicroelectronics], STM32F101X6_08 Datasheet - Page 68

• Manufacturer Part Number: STM32F101X6_08
• Description: Access line, advanced ARM-based 32-bit MCU with Flash memory, six 16-bit timers, ADC and seven communication interfaces
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Package characteristics
6.2
68/74
Thermal characteristics
The maximum chip junction temperature (T
Table 7: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 50.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
I/O
Symbol
Θ
max represents the maximum power dissipation on output pins where:
T
Θ
P
P
internal power.
P
JA
A
JA
D
INT
I/O
max is the maximum ambient temperature in ° C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in ° C/W,
max = Σ (V
max is the product of I
Thermal resistance junction-ambient
LQFP 100 - 14 x 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP 64 - 10 x 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 36 - 6 x 6 mm / 0.5 mm pitch
Thermal characteristics
OL
× I
OL
INT
T
) + Σ((V
Parameter
J
max = T
OL
max and P
DD
/ I
and V
DD
OL
and V
– V
A
DD
max + (P
I/O
OH
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
OH
max (P
) × I
28.
/ I
OH
OH
D
),
max x Θ
D
of the I/Os at low and high level in the
max = P
JA
)
INT
Value
46
45
55
18
max + P
I/O
STM32F101xx
max),
°C/W
Unit