LPC1317FHN33,551 NXP Semiconductors, LPC1317FHN33,551 Datasheet - Page 71

• Manufacturer Part Number: LPC1317FHN33,551
• Description: ARM Microcontrollers - MCU 32bit ARM Cortex-M3 64KB Flash 10KB SRAM
• Manufacturer: NXP Semiconductors

Specifications of LPC1317FHN33,551

• Rohs: yes
• Core: ARM Cortex M3
• Processor Series: LPC1317
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 72 MHz
• Program Memory Size: 64 KB
• Data Ram Size: 8 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 2 V to 3.6 V
• Operating Temperature Range: - 40 C to + 85 C
• Package / Case: HVQFN-33
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 260

NXP Semiconductors
LPC1315_16_17_45_46_47
Product data sheet
Fig 39. Reflow soldering of the LQFP64 package
Footprint information for reflow soldering of LQFP64 package
DIMENSIONS in mm
0.500
P1
0.560
P2
13.300 13.300 10.300 10.300
Hy
Ax
solder land
occupied area
Gy
Ay
C
Bx
By
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
P2
1.500
C
D2 (8×)
Rev. 3 — 20 September 2012
0.280
Generic footprint pattern
D1
0.400 10.500 10.500 13.550 13.550
P1
D2
Hx
Gx
Bx
Ax
Gx
LPC1315/16/17/45/46/47
(0.125)
Gy
32-bit ARM Cortex-M3 microcontroller
Hx
D1
Hy
By
© NXP B.V. 2012. All rights reserved.
Ay
sot314-2_fr
SOT314-2
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