LPC1111FHN33/102'5 NXP Semiconductors, LPC1111FHN33/102'5 Datasheet - Page 8
LPC1111FHN33/102'5
Manufacturer Part Number
LPC1111FHN33/102'5
Description
ARM Microcontrollers - MCU CORTEX-M0 8 KB FL 4 KB SRAM
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1113FHN333035.pdf
(538 pages)
Specifications of LPC1111FHN33/102'5
Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1111
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 65 C to + 150 C
Mounting Style
SMD/SMT
Interface Type
I2C, SPI, UART
Number Of Programmable I/os
42
Number Of Timers
4
Program Memory Type
Flash
Factory Pack Quantity
4000
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NXP Semiconductors
Table 2.
UM10398
User manual
Type number
LPC1113FHN33/201
LPC1113FHN33/202
LPC1113FHN33/301
LPC1113FHN33/302
LPC1113FHN33/203
LPC1113FHN33/303
LPC1114FHN33/201
LPC1114FHN33/202
LPC1114FHN33/301
LPC1114FHN33/302
LPC1114FHI33/302
LPC1114FHI33/303
LPC1114FHN33/203
LPC1114FHN33/303
LPC1114FHN33/333
LPC1113FBD48/301
LPC1113FBD48/302
LPC1113FBD48/303
LPC1114FBD48/301
LPC1114FBD48/302
LPC1114FBD48/303
Ordering information
Package
Name
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
HVQFN33
LQFP48
LQFP48
LQFP48
LQFP48
LQFP48
LQFP48
…continued
All information provided in this document is subject to legal disclaimers.
Description
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5 5 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 5 5 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 7
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 7
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 7
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 7
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 7
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7 7
1.4 mm
Rev. 12 — 24 September 2012
Chapter 1: LPC111x/LPC11Cxx Introductory information
UM10398
© NXP B.V. 2012. All rights reserved.
Version
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SOT313-2
SOT313-2
SOT313-2
SOT313-2
SOT313-2
SOT313-2
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