W25X40BVZPIG Winbond Electronics, W25X40BVZPIG Datasheet - Page 31

• Manufacturer Part Number: W25X40BVZPIG
• Description: IC SPI FLASH 4MBIT 8WSON
• Manufacturer: Winbond Electronics

Specifications of W25X40BVZPIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 4M (512K x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-WSON
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

W25X10BV/20BV/40BV
9.2.19
Release Power-down / Device ID (ABh)
The Release from Power-down / Device ID instruction is a multi-purpose instruction. It can be used to
release the device from the power-down state, obtain the devices electronic identification (ID) number
or do both.
When used only to release the device from the power-down state, the instruction is issued by driving
the /CS pin low, shifting the instruction code “ABh” and driving /CS high as shown in figure 19. After
the time duration of t
(See AC Characteristics) the device will resume normal operation and other
RES1
instructions will be accepted. The /CS pin must remain high during the t
time duration.
RES1
When used only to obtain the Device ID while not in the power-down state, the instruction is initiated
by driving the /CS pin low and shifting the instruction code “ABh” followed by 3-dummy bytes. The
Device ID bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as
shown in figure 19. The Device ID values for the W25X10BV/20BV/40BV are listed in Manufacturer
and Device Identification table. The Device ID can be read continuously. The instruction is completed
by driving /CS high.
When used to release the device from the power-down state and obtain the Device ID, the instruction
is the same as previously described, and shown in figure 20, except that after /CS is driven high it
must remain high for a time duration of t
(See AC Characteristics). After this time duration the
RES2
device will resume normal operation and other instructions will be accepted.
If the Release from Power-down / Device ID instruction is issued while an Erase, Program or Write
cycle is in process (when BUSY equals 1) the instruction is ignored and will not have any effects on
the current cycle
Figure 19. Release Power-down Instruction Sequence
Publication Release Date: August 20, 2009
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Preliminary -- Revision B