W25X40BVZPIG Winbond Electronics, W25X40BVZPIG Datasheet - Page 39

• Manufacturer Part Number: W25X40BVZPIG
• Description: IC SPI FLASH 4MBIT 8WSON
• Manufacturer: Winbond Electronics

Specifications of W25X40BVZPIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 4M (512K x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-WSON
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10.4 DC Electrical Characteristics
Notes:
1. Tested on sample basis and specified through design and characterization data. TA=25°C, VCC=3V.
2. Checker Board Pattern.
PARAMETER
Input Capacitance
Output Capacitance
Input Leakage
I/O Leakage
Standby Current
Power-down Current
Current Read Data /
Dual Output 1MHz
Current Read Data /
Dual Output 33MHz
Current Read Data /
Dual Output 80MHz
Current Write Status
Register
Current Page Program I
Current Sector/Block
Erase
Current Chip Erase
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
(2)
(2)
(2)
SYMBOL CONDITIONS
C
Cout
I
I
I
I
I
I
I
I
I
I
V
V
V
V
LI
LO
CC
CC
CC
CC
CC
CC
CC
CC
CC
IL
IH
OL
OH
IN
1
2
3
3
3
4
5
6
7
(1)
(1)
V
V
/CS = VCC,
VIN = GND or VCC
/CS = VCC,
VIN = GND or VCC
C = 0.1 VCC / 0.9 VCC
DO = Open
C = 0.1 VCC / 0.9 VCC
DO = Open
C = 0.1 VCC / 0.9 VCC
DO = Open
/CS = VCC
/CS = VCC
/CS = VCC
/CS = VCC
I
I
OL
OH
IN
OUT
= 1.6 mA
= 0V
= –100 µA
= 0V
(2)
(2)
- 39 -
W25X10BV/20BV/40BV
Publication Release Date: August 20, 2009
VCC–0.2
VCCx0.7
–0.5
MIN
10/11
SPEC
TYP
4/5
6/7
25
20
20
20
1
8
Preliminary -- Revision B
VCC+0.4
VCCx0.3
15/16.5
6/7.5
MAX
9/10
0.4
±2
±2
50
12
25
25
25
6
8
5
UNIT
mA
mA
mA
mA
mA
mA
mA
µA
µA
µA
µA
pF
pF
V
V
V
V