W25X40BVZPIG Winbond Electronics, W25X40BVZPIG Datasheet - Page 45
W25X40BVZPIG
Manufacturer Part Number
W25X40BVZPIG
Description
IC SPI FLASH 4MBIT 8WSON
Manufacturer
Winbond Electronics
Datasheet
1.W25X40BVSNIG.pdf
(51 pages)
Specifications of W25X40BVZPIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
4M (512K x 8)
Speed
104MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-WSON
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
11.2 8-Pin SOIC 208-mil (Package Code SS)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches
SYMBOL
D1
A1
A2
E1
A
C
D
H
b
E
e
L
y
θ
MIN
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
7.70
0.50
0°
-
MILLIMETERS
1.27 BSC
NOM
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
7.90
0.65
-
-
0.010
MAX
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
8.10
0.80
- 45 -
8°
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.303
0.020
MIN
W25X10BV/20BV/40BV
0°
-
Publication Release Date: August 20, 2009
0.050 BSC
INCHES
.
NOM
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.311
0.026
-
-
Preliminary -- Revision B
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
0.319
0.031
0.004
MAX
8°