W25X40BVZPIG Winbond Electronics, W25X40BVZPIG Datasheet - Page 44
W25X40BVZPIG
Manufacturer Part Number
W25X40BVZPIG
Description
IC SPI FLASH 4MBIT 8WSON
Manufacturer
Winbond Electronics
Datasheet
1.W25X40BVSNIG.pdf
(51 pages)
Specifications of W25X40BVZPIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
4M (512K x 8)
Speed
104MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-WSON
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
11.1 8-Pin SOIC 150-mil (Package Code SN)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches
11. PACKAGE SPECIFICATION
SEATING PLANE
Y
8
1
SYMBOL
D
E
Y
e
A1
H
A
b
c
L
(2)
(4)
(3)
(3)
E
b
D
e
1.35
0.10
0.33
0.19
3.80
4.80
5.80
0.40
Min
0°
-
5
4
MILLIMETERS
1.27 BSC
A1
- 44 -
A
E
H
E
Max
0.51
0.25
4.00
5.00
6.20
0.10
1.75
0.25
1.27
10°
W25X10BV/20BV/40BV
.
0.053
0.004
0.013
0.008
0.150
0.188
0.228
0.016
Min
0°
-
0.050 BSC
INCHES
0.069
0.010
0.020
0.010
0.157
0.196
0.244
0.004
0.050
Max
10°
0.25
GAUGE PLANE
c
L
O