W25X40BVZPIG Winbond Electronics, W25X40BVZPIG Datasheet - Page 34

• Manufacturer Part Number: W25X40BVZPIG
• Description: IC SPI FLASH 4MBIT 8WSON
• Manufacturer: Winbond Electronics

Specifications of W25X40BVZPIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 4M (512K x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-WSON
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

9.2.21
The Manufacturer / Device ID Dual I/O instruction is an alternative to the Read Manufacturer/Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID at 2x
speed.
The Read Manufacturer / Device ID Dual I/O instruction is similar to the Fast Read Dual I/O
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “92h”
followed by a 24-bit address (A23-A0) of 000000h, but with the capability to input the Address bits two
bits per clock. After which, the Manufacturer ID for Winbond (EFh) and the Device ID are shifted out 2
bits per clock on the falling edge of CLK with most significant bits (MSB) first as shown in figure 22.
The Device ID values for the W25X10BV/20BV/40BV are listed in Manufacturer and Device
Identification table. If the 24-bit address is initially set to 000001h the Device ID will be read first and
then followed by the Manufacturer ID. The Manufacturer and Device IDs can be read continuously,
alternating from one to the other. The instruction is completed by driving /CS high.
Note:
The “Continuous Read Mode” bits M7-0 must be set to Fxh to be compatible with Fast Read Dual I/O instruction.
Read Manufacturer / Device ID Dual I/O (92h)
Figure 22. Read Manufacturer / Device ID Dual I/O Diagram
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W25X10BV/20BV/40BV