MA330028 Microchip Technology, MA330028 Datasheet - Page 398

• Manufacturer Part Number: MA330028
• Description: Daughter Cards & OEM Boards dsPIC33EP64MC504 PIM
• Manufacturer: Microchip Technology

Specifications of MA330028

• Rohs: yes
• Product: Daughter Cards
• Core: dsPIC
• Description/function: Plug-in-module with dsPIC33EP64MC504 device for use with DM330021 and DM330023 motor control development board
• Interface Type: CAN, I2C, SPI
• Operating Supply Voltage: 3 to 3.6 V
• Tool Is For Evaluation Of: dsPIC33EP64MC504
• For Use With: DM330021, DM330023

30.1
TABLE 30-1:
TABLE 30-2:
TABLE 30-3:
DS70657E-page 398
Characteristic
Note 1:
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 64-Pin QFN
Package Thermal Resistance, 64-Pin TQFP 10x10 mm
Package Thermal Resistance, 44-Pin QFN
Package Thermal Resistance, 44-Pin TQFP 10x10 mm
Package Thermal Resistance, 44-Pin VTLA 6x6 mm
Package Thermal Resistance, 36-Pin VTLA 5x5 mm
Package Thermal Resistance, 28-Pin QFN-S
Package Thermal Resistance, 28-Pin SSOP
Package Thermal Resistance, 28-Pin SOIC
Package Thermal Resistance, 28-Pin SPDIP
Note 1:
—
—
I/O = Σ ({V
DC Characteristics
P
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Device is functional at V
Comparator voltage reference will have degraded performance. Device functionality is tested but not
characterized. Refer to parameter
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
2.95V to 3.6V
2.95V to 3.6V
– V
V
DD
(in Volts)
DD
OH
Characteristic
– Σ I
Range
} x I
Rating
OH
OH
)
(1)
(1)
) + Σ (V
BORMIN
OL
< V
x I
BO10
DD
OL
< V
-40°C to +125°C
)
Preliminary
-40°C to +85°C
Temp Range
in
DDMIN
Table 30-12
(in °C)
JA
. Analog modules: ADC, Op amp/Comparator, and
(
θ
JA
) numbers are achieved by package simulations.
for the minimum and maximum BOR values.
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
JA
JA
JA
JA
JA
A
A
D
J
J
dsPIC33EPXXXMC20X/50X, and
Min.
Typ.
28.0
48.3
29.0
49.8
25.2
28.5
30.0
71.0
69.7
60.0
-40
-40
-40
-40
© 2011-2012 Microchip Technology Inc.
PIC24EPXXXGP/MC20X
dsPIC33EPXXXGP50X,
(T
P
Maximum MIPS
J
INT
– T
Max.
Typ.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
+ P
A
)/θ
70
60
I
/
O
JA
Max.
+125
+140
+125
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
1
1
1
1
1