MT48LC4M32B2TG-7:G Micron Technology Inc, MT48LC4M32B2TG-7:G Datasheet - Page 67

IC SDRAM 128MBIT 143MHZ 86TSOP

MT48LC4M32B2TG-7:G

Manufacturer Part Number
MT48LC4M32B2TG-7:G
Description
IC SDRAM 128MBIT 143MHZ 86TSOP
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC4M32B2TG-7:G

Format - Memory
RAM
Memory Type
SDRAM
Memory Size
128M (4Mx32)
Speed
143MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
86-TSOPII
Organization
4Mx32
Density
128Mb
Address Bus
14b
Access Time (max)
17/8/5.5ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
175mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC4M32B2TG-7:G
Manufacturer:
micron
Quantity:
415
Part Number:
MT48LC4M32B2TG-7:G
Manufacturer:
MICRONAS
Quantity:
20 000
Figure 50:
PDF: 09005aef80872800/Source: 09005aef80863355
128MbSDRAMx32_2.fm - Rev. L 1/09 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
SEATING PLANE
DIMENSIONS APPLY
TO SOLDER BALLS POST
REFLOW. THE PRE-
REFLOW DIAMETER IS
0.42 ON A 0.40 SMD
BALL PAD
for production devices. Although considered final, these specifications are subject to change, as further product
11.20 ±0.10
90X Ø0.45
0.10 A
90-Ball VFBGA (8mm x 13mm)
BALL A9
5.60 ±0.05
Notes:
prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992
A
0.65 ±0.05
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
1. All dimensions in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. Recommended pad size for PCB is 0.33mm ±0.025mm.
0.25mm per side.
3.20
development and data characterization sometimes occur.
8.00 ±0.10
6.40
C L
4.00 ±0.05
their respective owners.
C L
6.50 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
67
13.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
Package Dimensions
©2001 Micron Technology, Inc. All rights reserved.
128Mb: x32 SDRAM
BALL A1 ID

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