TLE7810G Infineon Technologies, TLE7810G Datasheet - Page 50

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TLE7810G

Manufacturer Part Number
TLE7810G
Description
IC LDO VREG/LIN TXRX DSO-28
Manufacturer
Infineon Technologies
Datasheet

Specifications of TLE7810G

Applications
Special Purpose
Voltage - Supply
3.9 V ~ 27 V
Operating Temperature
-40°C ~ 150°C
Mounting Type
Surface Mount
Package / Case
DSO-28
Data Bus Width
8 bit
Program Memory Type
Flash
Program Memory Size
16 KB
Data Ram Size
768 B
Interface Type
SPI, SSC, UART
Maximum Clock Frequency
4 MHz
Number Of Timers
3
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Supply
-
Lead Free Status / Rohs Status
 Details
Other names
SP000313890

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TLE7810G
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Company:
Part Number:
TLE7810G
Quantity:
4 800
18.3
For flash programming the transmission rate of the integrated LIN transceiver can be changed to maximum
115 kBaud via SPI command. A dedicated BROM routine of the XC866 takes care of periodically servicing the
watchdog during this LIN-Fast-Mode. Further details are available in the XC866 User’s Manual.
Figure 20
18.4
T
The total power dissipation can be calculated from:
P
18.5
Tests for ESD robustness according to IEC61000-4-2 “gun test” (150pF, 330Ω) have been performed. The results
and test condition are available in a test report.
Table 15
Performed Test
ESD at pin LIN, V
ESD at pin LIN, V
1) ESD susceptibility “ESD GUN” according LIN EMC 1.3 Test Specification, Section 4.3. (IEC 61000-4-2) -Tested by external
Data Sheet
LIN FLASH mode on
LIN FLASH mode off
J
D
=
=
T
T
P
P
P
R
test house (IBEE Zwickau, EMC Test report Nr. ).
T
J
A
D
INT
IO
thJA
P
A
= Junction temperature [°C]
= Ambient temperature [°C]
= Total chip power dissipation [W]
INT
= Power dissipation caused by I/O currents [W]
+ (
= Chip internal power dissipation [W]
= Package thermal resistance [K/W]; junction-ambient
+
P
P
D
Input Data
Flash Program Mode via LIN-Fast-Mode
LIN Flash mode SPI command
Thermal Resistance
ESD Tests
ESD “GUN test”
IO
×
R
S
S
, MON4 versus GND
, MON4 versus GND
thJA
)
MSB
15 14 13 12 11 10
1
0
0
0
0
0
0
0
≥ +8
≤ -8
Result
0
0
0
0
50
Unit
kV
kV
9
0
0
8
0
0
Remarks
1)
1)
Positive pulse
Negative pulse
7
0
0
6
0
0
5
0
0
4
1
1
Application Information
Rev. 3.01, 2008-04-15
3
0
0
2
0
0
TLE7810G
1
0
0
LSB
0
0
0
(8)
(9)

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