STEVAL-ISQ002V1 STMicroelectronics, STEVAL-ISQ002V1 Datasheet - Page 160

• Manufacturer Part Number: STEVAL-ISQ002V1
• Description: BOARD EVAL BASED ON ST72264G1
• Manufacturer: STMicroelectronics

Specifications of STEVAL-ISQ002V1

• Main Purpose: Interface, PMBus
• Embedded: Yes, MCU, 8-Bit
• Utilized Ic / Part: ST72F264
• Primary Attributes: The PMBus™ Interface Using the ST7 I2C Peripheral
• Secondary Attributes: Firmware in C Language
• Product: Power Management Modules
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-6423

ST72260Gx, ST72262Gx, ST72264Gx
Figure 104. Low Profile Fine Pitch Ball Grid Array Package
14.2 THERMAL CHARACTERISTICS
Notes:
1. The power dissipation is obtained from the formula P
and P
2. The average chip-junction temperature can be obtained from the formula T
160/172
PORT
Symbol
T
R
Jmax
P
is the port power dissipation determined by the user.
thJA
D
SEATING
PLANE
C
Package thermal resistance (junction to ambient)
Power dissipation
Maximum junction temperature
A1 CORNER INDEX AREA
(SEE NOTE 3)
e
BOTTOM VIEW
D1
D
1)
LFBGA 6x6 (on single-layer PCB)
LFBGA 6x6 (on multilayer PCB)
Ratings
f
∅b (36 BALLS)
D
=P
2)
INT
+P
PORT
where P
SDIP32
SO28
J
= T
INT
Dim
ddd
A1 0.270
A2
D1
E1
A
D
b
E
e
f
A
is the chip internal power (I
+ P
1.210
0.450 0.500 0.550 0.018 0.020 0.022
5.750 6.000 6.150 0.226 0.236 0.242
5.750 6.000 6.150 0.226 0.236 0.242
0.720 0.800 0.880 0.028 0.031 0.035
0.850 1.000 1.150 0.033 0.039 0.045
Min
D
x RthJA.
1.120
4.000
4.000
mm
Typ Max Min
Value
150
500
60
75
56
72
1.700 0.048
0.120
0.011
inches
0.044
0.157
0.157
Typ Max
°C/W
DD
Unit
mW
°C
0.067
0.005
xV
DD
)