MPC8308-RDB Freescale Semiconductor, MPC8308-RDB Datasheet - Page 80

• Manufacturer Part Number: MPC8308-RDB
• Description: BOARD REF DESIGN MPC8308
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II™ PROr
• Type: MPUr

Specifications of MPC8308-RDB

• Contents: Board, Cables, Documentation, Power Supply, Software
• Ethernet Connection Type: Serial to Ethernet
• Data Rate: 10 Mbps, 100 Mbps, 1000 Mbps
• Memory Type: DDR2, SDRAM
• Interface Type: HSSI
• Operating Voltage: 1.5 V
• Operating Current: 5 uA
• Maximum Power Dissipation: 1000 mW
• Operating Temperature Range: - 55 C to + 125 C
• Product: Modules
• For Use With/related Products: MPC8308
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Thermal
22 Thermal
This section describes the thermal specifications of the device.
22.1
Table 59
80
Junction to Ambient Natural Convection
Junction to Ambient Natural Convection
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top
1
2
Note:
0–1
For any core_clk:csb_clk ratios, the core_clk must not exceed its maximum operating frequency of 400 MHz.
Core VCO frequency = core frequency × VCO divider. Note that VCO divider has to be set properly so that the
core VCO frequency is in the range of 400–800 MHz.
10
00
01
10
RCWL[COREPLL]
provides the package thermal characteristics for the 473, 19 × 19 mm MAPBGA.
Thermal Characteristics
Characteristic
0010
0011
0011
0011
2–5
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 2
6
1
0
0
0
Table 59. Package Thermal Characteristics for MAPBGA
Table 58. e300 Core PLL Configuration (continued)
core_clk: csb_clk Ratio
2.5:1
3:1
3:1
3:1
Four layer board (2s2p)
Four layer board (2s2p)
Single layer board (1s)
Single layer board (1s)
Natural Convection
Board Type
—
—
1
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJA
θJA
θJB
θJC
JT
VCO Divider (VCOD)
Value
8
2
4
8
42
27
35
24
17
9
2
Freescale Semiconductor
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
1,2,3
1,2
1,3
1,3
4
5
6