LPC2478FBD208,551 NXP Semiconductors, LPC2478FBD208,551 Datasheet - Page 376

IC ARM7 MCU 512K LCD 208-LQFP

LPC2478FBD208,551

Manufacturer Part Number
LPC2478FBD208,551
Description
IC ARM7 MCU 512K LCD 208-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets

Specifications of LPC2478FBD208,551

Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/IrDA/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, DK-35TS-LPC2478, DK-57TS-LPC2478, DK-57VTS-LPC2478, SOMDIMM-LPC2478, SAB-TFBGA208, KSK-LPC2478-JL, MCB2470
Development Tools By Supplier
OM11015, OM11019, OM11022
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1034 - PROGRAMMERS, DEVELOPMENT SYSTEMS622-1033 - KIT LCD TOUCH 5.7" FOR LPC2478MCB2470 - BOARD EVAL NXP LPC247X SERIESOM11022 - EVAL LPC-STICK WITH LPC2478OM11019 - BOARD EVAL FOR LPC2478568-4742 - MODULE DIMM LPC2478 ARM7568-4741 - KIT LCD TOUCH 5.7" FOR LPC2478622-1028 - KIT LCD TOUCH 5.7" FOR LPC2478KSDKLPC2478-PL - KIT IAR KICKSTART NXP LPC2478622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4369 - BOARD EVAL FOR LPC2478622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4363
935284069551
LPC2478FBD208-S

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NXP Semiconductors
UM10237_4
User manual
14.4 The DMA descriptor
In DMA mode, the bits corresponding to Interrupt on NAK for Bulk OUT and Interrupt OUT
endpoints (INAK_BO and INAK_IO) should be set to 0 using the SIE Set Mode command
(Section
DMA transfers are described by a data structure called the DMA Descriptor (DD).
DDs are placed in the USB RAM. These descriptors can be located anywhere in the USB
RAM at word-aligned addresses. USB RAM is part of the system memory that is used for
the USB purposes. It is located at address 0x7FD0 0000 and is 8 kB in size.
DDs for non-isochronous endpoints are four words long. DDs for isochronous endpoints
are five words long.
The parameters associated with a DMA transfer are:
Table 13–357
Table 357. DMA descriptor
Word
position
0
1
2
The start address of the DMA buffer
The length of the DMA buffer
The start address of the next DMA descriptor
Control information
Count information (number of bytes transferred)
Status information
13–11.3).
Access
(H/W)
R
R
R
-
R
R
R/W
R/W
[1]
lists the DMA descriptor fields.
Access
(S/W)
R/W
R/W
R/W
-
R/W
R/W
R/W
R/W
Rev. 04 — 26 August 2009
Bit
position
31:0
1:0
2
3
4
15:5
31:16
31:0
Description
Next_DD_pointer (USB RAM address)
DMA_mode (00 -Normal; 01 - ATLE)
Next_DD_valid (1 - valid; 0 - invalid)
Reserved
Isochronous_endpoint (1 - isochronous;
0 - non-isochronous)
Max_packet_size
DMA_buffer_length
This value is specified in bytes for non-isochronous
endpoints and in number of packets for isochronous
endpoints.
DMA_buffer_start_addr
Chapter 13: LPC24XX USB device controller
UM10237
© NXP B.V. 2009. All rights reserved.
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