LPC2478FBD208,551 NXP Semiconductors, LPC2478FBD208,551 Datasheet - Page 541

• Manufacturer Part Number: LPC2478FBD208,551
• Description: IC ARM7 MCU 512K LCD 208-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2478FBD208,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 208-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/IrDA/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, DK-35TS-LPC2478, DK-57TS-LPC2478, DK-57VTS-LPC2478, SOMDIMM-LPC2478, SAB-TFBGA208, KSK-LPC2478-JL, MCB2470
• Development Tools By Supplier: OM11015, OM11019, OM11022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1034 - PROGRAMMERS, DEVELOPMENT SYSTEMS622-1033 - KIT LCD TOUCH 5.7" FOR LPC2478MCB2470 - BOARD EVAL NXP LPC247X SERIESOM11022 - EVAL LPC-STICK WITH LPC2478OM11019 - BOARD EVAL FOR LPC2478568-4742 - MODULE DIMM LPC2478 ARM7568-4741 - KIT LCD TOUCH 5.7" FOR LPC2478622-1028 - KIT LCD TOUCH 5.7" FOR LPC2478KSDKLPC2478-PL - KIT IAR KICKSTART NXP LPC2478622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4369 - BOARD EVAL FOR LPC2478622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4363; 935284069551; LPC2478FBD208-S

NXP Semiconductors
UM10237_4
User manual
Fig 99. SPI frame format with CPOL = 1 and CPHA = 0 (a) Single and b) Continuous Transfer)
a. Single transfer with CPOL=1 and CPHA=0
b. Continuous transfer with CPOL=1 and CPHA=0
SSEL
MOSI
MISO
SCK
MSB
MSB
In this configuration, during idle periods:
If the SSP is enabled and there is valid data within the transmit FIFO, the start of
transmission is signified by the SSEL master signal being driven LOW, which causes
slave data to be immediately transferred onto the MISO line of the master. Master’s MOSI
pin is enabled.
One half period later, valid master data is transferred to the MOSI line. Now that both the
master and slave data have been set, the SCK master clock pin becomes LOW after one
further half SCK period. This means that data is captured on the falling edges and be
propagated on the rising edges of the SCK signal.
In the case of a single word transmission, after all bits of the data word are transferred, the
SSEL line is returned to its idle HIGH state one SCK period after the last bit has been
captured.
However, in the case of continuous back-to-back transmissions, the SSEL signal must be
pulsed HIGH between each data word transfer. This is because the slave select pin
freezes the data in its serial peripheral register and does not allow it to be altered if the
CPHA bit is logic zero. Therefore the master device must raise the SSEL pin of the slave
device between each data transfer to enable the serial peripheral data write. On
completion of the continuous transfer, the SSEL pin is returned to its idle state one SCK
period after the last bit has been captured.
•
•
•
The CLK signal is forced HIGH.
SSEL is forced HIGH.
The transmit MOSI/MISO pad is in high impedance.
SSEL
MOSI
MISO
SCK
4 to 16 bits
MSB
Rev. 04 — 26 August 2009
LSB
LSB
MSB
Q
4 to 16 bits
Chapter 20: LPC24XX SSP interface SSP0/1
MSB
MSB
LSB
LSB
Q
4 to 16 bits
UM10237
© NXP B.V. 2009. All rights reserved.
LSB
LSB
Q
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