MCF5485CVR200 Freescale Semiconductor, MCF5485CVR200 Datasheet - Page 26

• Manufacturer Part Number: MCF5485CVR200
• Description: IC MPU 32BIT COLDF 388-PBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF548xr

Specifications of MCF5485CVR200

• Core Processor: Coldfire V4E
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 99
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.43 V ~ 1.58 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 388-BGA
• Processor Series: MCF548x
• Core: ColdFire V4
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Maximum Clock Frequency: 83 MHz
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: M5485EVBE, M5485EVBGHSE, M5484LITEKITE
• Minimum Operating Temperature: - 40 C
• Program Memory Size: 64KB
• Cpu Speed: 200MHz
• Embedded Interface Type: I2C, UART, DMA
• Digital Ic Case Style: BGA
• No. Of Pins: 388
• Rohs Compliant: Yes
• For Use With: M5485EVBGHSE - KIT DEV GHS FOR M5485EVBM5485EVBGHS - KIT DEV GHS FOR M5485EVBM5485BFEE - MODULE MCF5485 FIRE ENGINEM5485AFEE - MODULE MCF5485 FIRE ENGINEM5485AFE - MODULE MCF5485 FIRE ENGINEM5484GFEE - MODULE M5484 FIRE ENGINEM5484LITEKITE - KIT DEV FOR MCF548X FAMILY
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

JTAG and Boundary Scan Timing
Figure 23
14
26
1
Num
J10
J11
J12
J13
J14
MTMOD is expected to be a static signal. Hence, it is not associated with any timing
J1
J2
J3
J4
J5
J6
J7
J8
J9
shows timing for the values in
JTAG and Boundary Scan Timing
TCLK Frequency of Operation
TCLK Cycle Period
TCLK Clock Pulse Width
TCLK Rise and Fall Times
Boundary Scan Input Data Setup Time to TCLK Rise
Boundary Scan Input Data Hold Time after TCLK Rise
TCLK Low to Boundary Scan Output Data Valid
TCLK Low to Boundary Scan Output High Z
TMS, TDI Input Data Setup Time to TCLK Rise
TMS, TDI Input Data Hold Time after TCLK Rise
TRST Assert Time
TRST Setup Time (Negation) to TCLK High
TCLK Low to TDO Data Valid
TCLK Low to TDO High Z
1
2
3
SDA
SCL
Output numbers depend on the value programmed into the IFDR; an IFDR programmed with the
maximum frequency (IFDR = 0x20) results in minimum output timings as shown in
I
SCL low period. The actual position is affected by the prescale and division values programmed
into the IFDR; however, the numbers given in
Because SCL and SDA are open-collector-type outputs, which the processor can only actively
drive low, the time SCL or SDA take to reach a high level depends on external signal capacitance
and pull-up resistor values.
Specified at a nominal 50-pF load.
2
C interface is designed to scale the actual data transition time to move it to the middle of the
I2
I1
Characteristics
Table 22. JTAG and Boundary Scan Timing
MCF548x ColdFire
I4
Table 20
Figure 23. I
and
1
Table
I7
2
C Input/Output Timings
®
21.
Microprocessor, Rev. 4
Table 21
I6
I8
are minimum values.
I5
Symbol
t
t
t
t
t
t
t
t
TAPBHT
TRSTST
TAPBST
TRSTAT
f
t
BSDST
BSDHT
t
t
TDODV
TDODZ
t
t
BSDV
BSDZ
JCYC
JCYC
JCRF
JCW
15.15
100.0
I3
24.0
10.0
10.0
Min
DC
0.0
5.0
0.0
0.0
5.0
0.0
0.0
2
Table
Freescale Semiconductor
Max
15.0
15.0
20.0
15.0
3.0
21. The
10
—
—
—
—
—
—
—
—
I9
MHz
Unit
t
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CK