AT89S8253-24PU Atmel, AT89S8253-24PU Datasheet - Page 33

IC 8051 MCU FLASH 12K 40DIP

AT89S8253-24PU

Manufacturer Part Number
AT89S8253-24PU
Description
IC 8051 MCU FLASH 12K 40DIP
Manufacturer
Atmel
Series
89Sr
Datasheet

Specifications of AT89S8253-24PU

Core Processor
8051
Core Size
8-Bit
Speed
24MHz
Connectivity
SPI, UART/USART
Peripherals
POR, WDT
Number Of I /o
32
Program Memory Size
12KB (12K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Cpu Family
89S
Device Core
8051
Device Core Size
8b
Frequency (max)
24MHz
Interface Type
SPI/UART
Total Internal Ram Size
256Byte
# I/os (max)
32
Number Of Timers - General Purpose
3
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Through Hole
Pin Count
40
Package Type
PDIP
Processor Series
AT89x
Core
8051
Data Bus Width
8 bit
Data Ram Size
256 B
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
32
Number Of Timers
3
Operating Supply Voltage
2.7 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
AT89ISP
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Converters
-
Lead Free Status / Rohs Status
Compliant

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16. Oscillator Characteristics
3286P–MICRO–3/10
XTAL1 and XTAL2 are the input and output, respectively, of an inverting amplifier that can be
configured for use as an on-chip oscillator, as shown in
crystal or ceramic resonator may be used. For frequencies above 16MHz it is recommended that
C1 be replaced with R1 for improved startup performance. Note that the internal structure of the
devices adds about 10 pF of capacitance to both XTAL1 and XTAL2. The total capacitance on
XTAL1 or XTAL2, including the external load capacitor (C1/C2) plus internal device load, board
trace and crystal loadings, should not exceed 20 pF.
the relationship between clock loading and the respective resulting clock amplitudes.
Figure 16-1. Oscillator Connections
Note:
Figure 16-2. Quartz Crystal Clock Source (A)
C1, C2 = 0–10 pF for Crystals
R1
6
5
4
3
2
1
0
0
(A) Low Frequency
= 0–10 pF for Ceramic Resonators
= 4–5 MΩ
C2
C1
4
Quartz Crystal Clock Input
8
~10 pF
~10 pF
Frequency (MHz)
12
Figure
(B) High Frequency
16
Figure 16-1
C2
R1
16-2, 16-3,
20
(A) and (B). Either a quartz
C1=C2=0pF
C1=C2=5pF
C1=C2=10pF
16-4
AT89S8253
and
24
~10 pF
~10 pF
16-5
illustrate
33

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