AT32UC3B0512-Z2UR Atmel, AT32UC3B0512-Z2UR Datasheet - Page 637

IC MCU AVR32 512K FLASH 64QFN

AT32UC3B0512-Z2UR

Manufacturer Part Number
AT32UC3B0512-Z2UR
Description
IC MCU AVR32 512K FLASH 64QFN
Manufacturer
Atmel
Series
AVR®32 UC3r
Datasheet

Specifications of AT32UC3B0512-Z2UR

Package / Case
64-QFN
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Operating Temperature
-40°C ~ 85°C
Speed
60MHz
Number Of I /o
44
Core Processor
AVR
Program Memory Type
FLASH
Ram Size
96K x 8
Program Memory Size
512KB (512K x 8)
Data Converters
A/D 8x10b
Oscillator Type
Internal
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity
I²C, IrDA, SPI, SSC, UART/USART, USB
Core Size
32-Bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT32UC3B0512-Z2UR
Manufacturer:
ATMEL
Quantity:
2 010
29. Mechanical Characteristics
29.1
29.1.1
29.1.2
32059J–12/2010
Thermal Considerations
Thermal Data
Junction Temperature
Table 29-1
Table 29-1.
The average chip-junction temperature, T
where:
• θ
• θ
• θ
• P
• T
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
1.
2.
637.
Table 29-1 on page
Consumption” on page
JA
JC
JA
JC
JA
JC
HEAT SINK
A
D
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
T
T
J
J
=
=
T
summarizes the thermal resistance data depending on the package.
= cooling device thermal resistance (°C/W), provided in the device datasheet.
T
A
A
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
637.
θ
HEATSINK
JA
625.
)
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Package
TQFP64
TQFP64
TQFP48
TQFP48
AT32UC3B
Table 29-1 on page
49.6
13.5
51.1
13.7
Typ
”Power
J
⋅C/W
⋅C/W
in °C.
Unit
637

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