LM317MT Fairchild Semiconductor, LM317MT Datasheet

IC REG 3TERM 0.5A POS ADJ TO-220

LM317MT

Manufacturer Part Number
LM317MT
Description
IC REG 3TERM 0.5A POS ADJ TO-220
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of LM317MT

Regulator Topology
Positive Adjustable
Voltage - Output
1.2 ~ 37 V
Voltage - Input
Up to 40V
Number Of Regulators
1
Current - Output
500mA (Max)
Operating Temperature
0°C ~ 125°C
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Polarity
Positive
Number Of Outputs
1
Output Type
Adjustable
Output Voltage
1.2 V to 37 V
Output Current
100 mA
Line Regulation
0.04 % / V
Load Regulation
0.5 % / V
Input Voltage Max
40 V
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
0 C
Mounting Style
Through Hole
Reference Voltage
1.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Dropout (typical)
-
Current - Limit (min)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
LM317MTFS

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This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
Updated process quality documentation, such as FMEAs and Control Plans, are available for
viewing upon request.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Sun, Brian
E-mail: Brian.Sun@fairchildsemi.com
Phone:
Implementation of change:
Expected 1st Device Shipment Date: 2008/01/29
Earliest Year/Work Week of Changed Product: 0805
Change Type Description: Bond Wire Material Composition, Lead Frame Dimensions (Internal
and External)
Description of Change (From): Current TO-220 heatsink and die attach pad thickness of
1.30mm. Material composition of wire used for wire bonding process is gold (Au) wire and
copper (Cu) wire.
Description of Change (To): New TO-220 heatsink and die attach pad thickness will be
0.51mm. There is no change in heatsink and die attach pad material. Material composition of
wire used during wire bonding process will be copper (Cu). Conversion of heatsink thickness
will be done on a part by part basis starting WW05 of 2008 to prevent mixing of product with
different heat sink dimensions in shipments during the transition period.
Reason for Change : Enhancement of leadframe design to improve package mechanical
performance and support additional demand for various TO-220 products to improve our
service to customers. There is insignificant difference in product thermal performance.
Qual/REL Plan Numbers : Q20070208
Qualification :
Passed and meet the FSC rel performance requirement
Change From
DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL
Technical Contact:
Name: LEE, SANGDO
E-mail: SANGDO.LEE@fairchildsemi.com
Phone: 86-512-6762-3311 ext 8671
Date Issued On : 2007/11/29
Date Created : 2007/11/15
PCN# : Q3073801-A
Pg. 1

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LM317MT Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

Change To Pg. 2 ...

Page 3

Results/Discussion Test: (Autoclave) Lot Device Q20070208AAACLV MC78T12CT Q20070208BAACLV KA350TU Q20070208CAACLV KSE13003TH2ATU Q20070208DAACLV KSE13009TU Q20070208EAACLV FJP5027RTU_F080 Test: (High Temperature Reverse Bias) Lot Device Q20070208CAHTRB KSE13003TH2ATU Q20070208DAHTRB KSE13009TU Q20070208EAHTRB FJP5027RTU_F080 Test: (High Temperature Storage Life) Lot Device Q20070208AAHTSL MC78T12CT Q20070208BAHTSL KA350TU Q20070208CAHTSL ...

Page 4

... Q20070208CATMCL1 KSE13003TH2ATU Q20070208CATMCL1 KSE13003TH2ATU Q20070208DATMCL1 KSE13009TU Q20070208DATMCL1 KSE13009TU Q20070208EATMCL1 FJP5027RTU_F080 Q20070208EATMCL1 FJP5027RTU_F080 Product Id Description : Affected FSIDs : 495219TU_F080 KSA473O KSA473YTU KSC1173YTU KSE13003TH1ATU LM317MT LM350T LM7805ECT LM7808ACT LM7809CT LM7812ACT LM7815CT LM7824ACT LM7905CT 0/77 168-HOURS 500-HOURS 0/77 0/77 0/77 0/77 0/77 0/77 0/77 0/77 ...

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