KA79M12TU Fairchild Semiconductor, KA79M12TU Datasheet
KA79M12TU
Manufacturer Part Number
KA79M12TU
Description
IC REGULATOR 0.5A -12V 4% TO-220
Manufacturer
Fairchild Semiconductor
Datasheet
1.KA79M05RTF.pdf
(12 pages)
Specifications of KA79M12TU
Regulator Topology
Negative Fixed
Voltage - Output
-12V
Voltage - Input
Down to -35V
Voltage - Dropout (typical)
1.1V @ 500mA
Number Of Regulators
1
Current - Output
500mA
Operating Temperature
0°C ~ 125°C
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Polarity
Negative
Number Of Outputs
1
Output Type
Fixed
Output Voltage
- 12 V
Output Current
0.5 A
Line Regulation
80 mV
Load Regulation
240 mV
Dropout Voltage (max)
1.1 V
Input Voltage Max
- 40 V
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
0 C
Mounting Style
Through Hole
Voltage Regulation Accuracy
5 %
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Limit (min)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
KA79M12TU
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence. This is a preliminary
notification. A Final PCN will be issued when qualification is complete and data is available.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Sun, Brian
E-mail: Brian.Sun@fairchildsemi.com
Phone:
Implementation of change:
Expected 1st Device Shipment Date: 2007/11/24
Earliest Year/Work Week of Changed Product: 0747
Change Type Description: Bond Wire Material Composition, Lead Frame Dimensions (Internal
and External)
Description of Change (From): Thicker heatsink and die attach pad. Material composition for
wire used during wire bonding process is gold wire and copper.
Description of Change (To): Thinner heatsink and die attach pad (there is no change in heatsink
and die attach pad material). Material composition for wire used during wire bonding process
will be copper.
Reason for Change : Meet additional demand for various products in TO-220 package to
improve our service to customers.
Qual/REL Plan Numbers : Q20070208
Qualification :
Designed to qualify TO220 package using thinner heatsink and copper wire bonding
material Qualification Stress Test and Sample Size Detail
Change From
Technical Contact:
Name: LEE, SANGDO
E-mail: SANGDO.LEE@fairchildsemi.com
Phone: 86-512-6762-3311 ext 8671
FORECAST CHANGE NOTIFICATION
Date Issued On : 2007/10/09
Date Created : 2007/09/17
PCN# : Q3073801
Pg. 1
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KA79M12TU Summary of contents
Page 1
... This notification is for your information and concurrence. This is a preliminary notification. A Final PCN will be issued when qualification is complete and data is available. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. If you have any questions concerning this change, please contact: ...
Page 2
Change To Pg. 2 ...
Page 3
Qualification Stress Test and Sample Size Detail Device #1 FJP5027RTU_F080 Package: -1 #Leads: -1 Environment Stress Detail: Stress P/C Standard ACLV JESD22-A102 100%RH, 121C 96 HTRB JESD22-A108 150C, 80%BVV 168 THBT JESD22-A101 85%RH, 85C, TMCL1 JESD22-A104 -65C, 150C Device #2 ...
Page 4
TMCL1 JESD22-A104 -65C, 150C Device #3 KSE13003TH2ATU Package: #Leads: Environment Stress Detail: Stress P/C Standard ACLV JESD22-A102 100%RH, 121C 96 HTRB JESD22-A108 150C, 80%BVV 168 HTSL JESD22-A103 150C THBT JESD22-A101 85%RH, 85C, TMCL1 JESD22-A104 -65C, 150C Device #4 KSE13009TU Package: ...
Page 5
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