MCF5272CVF66 Freescale Semiconductor, MCF5272CVF66 Datasheet - Page 210

IC MPU 32BIT 66MHZ 196-MAPBGA

MCF5272CVF66

Manufacturer Part Number
MCF5272CVF66
Description
IC MPU 32BIT 66MHZ 196-MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF527xr
Datasheets

Specifications of MCF5272CVF66

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
66MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals
DMA, WDT
Number Of I /o
32
Program Memory Size
16KB (4K x 32)
Program Memory Type
ROM
Ram Size
1K x 32
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
196-MAPBGA
Family Name
MCF5xxx
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
66MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
196
Package Type
MA-BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Not Compliant

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SDRAM Controller
9.10.3
Figure 9-13
SDRAM writes all of its on-chip RAM page buffers into the SDRAM array. SDTR[RP] determines the
number of dead cycles after a precharge. Note that self refresh occurs during T3. In refresh state, SDRAM
cannot accept any other command.
9-20
A10_PRECHG
SDADR[13:0]
SDBA[1:0]
SDCLKE
SDCLK
SDWE
SDCS
SDRAM Refresh Timing
RAS0
CAS0
shows refresh-cycle timing. As in
(H)
MCF5272 ColdFire
T0
Precharge
All Banks
T1
Figure 9-13. SDRAM Refresh Cycle
®
T2
Integrated Microprocessor User’s Manual, Rev. 3
NOP
Figure
T3
Refresh
Auto
9-14, during a
T4
T5
PRECHARGE ALL
T6
t
RC
T7
Freescale Semiconductor
command (T1), the
Next Command
T8
T9

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