BLM18AG151SH1D Murata, BLM18AG151SH1D Datasheet - Page 30

• Manufacturer Part Number: BLM18AG151SH1D
• Description: EMI/RFI Suppressors & Ferrites 0603 150ohms Gen Use Tape
• Manufacturer: Murata
• Series: BLM Ar

Specifications of BLM18AG151SH1D

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 150 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 200 mAmps
• Maximum Dc Resistance: 0.25 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0603 (1608 metric)
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

!Note
!Note
1. Standard Land Pattern Dimensions
BLM18
NFM21
NFE61H
DLW31S
NFp series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum
performance from these filters, the ground pattern should be made as large as possible during the PCB design stage. As
shown in the right, one side of the PCB is used for chip mounting, and the other is used for grounding.
Small diameter feedthrough holes are then used to connect the grounds on each side of the PCB. This reduces the high-
frequency impedance of the grounding and maximizes the filter's performance.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
oReflow and Flow
BLM Series
o Reflow Soldering
o Reflow Soldering
Chip mounting side
oReflow Soldering
NFM21H
BLM18
(except 18PG type)
Chip mounting side
Part Number
DLW31S
Type
8.8
2.0
4.8
a
b
3
Small diameter thru hole ø0.4
(Except BLMppP series)
a
b
Soldering
Reflow
Flow
0.6
a
DLW31S
Series
1.4
b
0.7
Size (mm)
a
2.6
Small diameter
thru hole ø0.4
c
2.2-2.6
1.8-2.0
1.6
a
a
b
c
b
3.7
0.8
b
d
0.4
0.7
c
c
2.3
1.6
g
d
Chip mounting side
• Do not apply narrower pattern than listed above to BLMppP.
o Flow Soldering (Except NFE61HT332)
Do not use gild pattern; excess soldering heat may dissolve
metal of a copper wire.
BLMppP
BLM18PG
Narrow pattern can cause excessive heat or open circuit.
The chip EMI filter suppress noise by conducting the high-
frequency noise to ground. Therefore, to get enough noise
reduction, feed through holes which are connected to ground-
plane should be arranged according to the figure to reinforce
the ground-pattern.
• NFM21 is specially adapted for reflow soldering.
1: If the pattern is made with wider than 1.6mm (DLW31S) it
2: If the pattern is made with less than 0.4mm, in the worst
3: If the pattern is made with wider than 1.6mm (DLW31S),
Type
may result in components turning around, because melting
speed is different. In the worst case, short circuit between
lines may occur.
case, short circuit between lines may occur due to spread
of soldering paste or mount placing accuracy.
the bending strength will be reduced.
Small diameter thru hole ø0.4
1.5
3.8
4.8
9.0
Current
0.5-1.5
Rated
(A)
2
3
Soldering and Mounting
a
b
Soldering
Reflow
Flow/
0.7
a
Continued on the following page.
2.2-2.6
Reflow
1.8-2.0
Flow
b
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
0.7
c
Land pad thickness
18 m 35 m 70 m
0.7
1.2
2.4
and dimension d
C50E.pdf 05.1.28
0.7
0.7
1.2
0.7
0.7
0.7
(in mm)
29
3