BLM18AG151SH1D Murata, BLM18AG151SH1D Datasheet - Page 31

• Manufacturer Part Number: BLM18AG151SH1D
• Description: EMI/RFI Suppressors & Ferrites 0603 150ohms Gen Use Tape
• Manufacturer: Murata
• Series: BLM Ar

Specifications of BLM18AG151SH1D

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 150 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 200 mAmps
• Maximum Dc Resistance: 0.25 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0603 (1608 metric)
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

3
!Note
!Note
2. Solder Paste Printing and Adhesive Application
30
Soldering and Mounting
BLM
NFM
NFE61H
DLW
When reflow soldering the chip EMI suppression filter, the
printing must be conducted in accordance with the
following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack. In contrast, if too little solder is applied,
there is the potential that the termination strength will be
insufficient, creating the potential for detachment.
Standard land dimensions should be used for resist and
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
Series
DLW31S
oEnsure that solder is applied smoothly to a
oCoat the solder paste a thickness:
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat the solder paste a thickness:
NFM21H
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat the solder paste a thickness: 150-200 m
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat the solder paste a thickness:
*Solderability is subjected to reflow condition and
thermal conductivity. Please make sure that your
product has been evaluated in view of your
specifications with our product being mounted to your
product.
minimum height of 0.2mm to 0.3mm at the end
surface of the part.
100-200 m: BLM18
pattern printing.
100-150 m: NFM21
pattern printing.
pattern printing.
100-150 m: DLW31S
1.4
0.6
2.6
a
b
Solder Paste Printing
1.5
4.8
8.8
DLW31S
Series
1.6
a
3.7
b
0.4
c
copper foil patterns.
When flow soldering the EMI suppression filter, apply the
adhesive in accordance with the following conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
1.6
d
Coating amount is illustrated in the
following diagram.
PCB
Apply 1.0mg of bonding agent at each chip.
Bonding agent
Adhesive Application
Chip Solid Inductor
Land
Bonding agent
Continued on the following page.
Bonding agent
1.5
4.8
9.0
C50E.pdf 05.1.28
a: 20 70 m
b: 30 35 m
c: 50 105 m
a
b
(in mm)
c