BLM18AG151SH1D Murata, BLM18AG151SH1D Datasheet - Page 32

• Manufacturer Part Number: BLM18AG151SH1D
• Description: EMI/RFI Suppressors & Ferrites 0603 150ohms Gen Use Tape
• Manufacturer: Murata
• Series: BLM Ar

Specifications of BLM18AG151SH1D

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 150 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 200 mAmps
• Maximum Dc Resistance: 0.25 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0603 (1608 metric)
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

!Note
!Note
3. Standard Soldering Conditions
(1) Soldering Methods
Solder : H60A H63A solder (JIS Z 3238)
Flux :
o Use Rosin-based flux (when using RA type solder, clean
o Do not use strong acidic flux (with chlorine content
o Do not use water-soluble flux.
(2) Soldering profile
oFlow Soldering profile
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
EMI suppression filters.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
products sufficiently to avoid residual flux.
exceeding 0.20wt%)
Continued from the preceding page.
*
BLM
NFE61H*
(Eutectic solder, Sn-3.0Ag-0.5Cu solder)
Except NFE61HT332
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
Series
In case of lead-free solder, use Sn-3.0Ag-0.5Cu
solder
T1
Temp. (T1)
150 C 60s min. 250 C 4 to 6s
Pre-heating
Pre-heating
Time. (t1)
t1
T3
T2
Temp. (T2)
Standard Profile
Heating
Heating
t2
Time. (t2)
time (s)
times
Cycle
of flow Temp. (T3) Time. (t2)
2
Limit Profile
Standard Profile
265
3 C
Heating
Limit Profile
5s max.
times
of flow
Cycle
2
oReflow Soldering profile
qSoldering profile for Lead-free solder (Sn-3.0Ag-0.5Cu)
wSoldering profile for Eutectic solder
BLM, NFE
NFM, DLW
BLM, NFE
NFM, DLW
(Limit profile: refer to q)
Series
Series
180
150
T1
220 C min. 30 to 60s 245 3 C 2 times 230 C min.
Temp. (T1) Time. (t1)
Heating
Temp. (T1) Time. (t1)
150 C 60s min. 183 C min.
Standard Profile
Pre-heating
Pre-heating
90s 30s
Soldering and Mounting
t1
T2
T1
T3
T2
temperature
Peak
(T2)
of reflow
Temp. (T2) Time. (t2)
t1
t2
Cycle
t2
Heating
Continued on the following page.
Temp. (T3) Time. (t2)
time (s)
time (s)
Standard Profile
60s max.
T4
T3
Heating
Limit Profile
Standard Profile
Standard Profile
Limit Profile
60s max.
temperature
230 C 2 times
Peak
(T3)
C50E.pdf 05.1.28
temperature
260 C/10s 2 times
Peak
(T4)
of reflow
Cycle
of reflow
Cycle
31
3