FAN5902MPX Fairchild Semiconductor, FAN5902MPX Datasheet - Page 7

• Manufacturer Part Number: FAN5902MPX
• Description: IC CONV DC-DC 800MA RFPA 12-MLP
• Manufacturer: Fairchild Semiconductor

Specifications of FAN5902MPX

• Applications: Converter, 3G RF Power Amplifier
• Voltage - Input: 2.7 V ~ 5.5 V
• Number Of Outputs: 1
• Voltage - Output: 0.4 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 12-MLP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

© 2009 Fairchild Semiconductor Corporation
FAN5902 • Rev. 1.0.2.short
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
(Y)+/-.018
BALL A1
INDEX AREA
2X
D
0.05 C
0.03 C
0.50
0.50
C
BOTTOM VIEW
TOP VIEW
1 2
E
3
SEATING PLANE
(Continued)
D
C
B
A
(X)+/-.018
A
12 X Ø0.315 +/- .025
0.625
0.539
0.06 C
D
B
0.005
2X
Figure 10. 12-Bump WLCSP
0.03 C
C A B
SIDE VIEWS
C. DIMENSIONS AND TOLERANCES PER
G. DRAWING FILENAME: MKT-UC012AArev2
7
D
F
F. BALL COMPOSITION: Sn95.5Ag3.9Cu0.6
A. NO JEDEC REGISTRATION APPLIES
B. DIMENSIONS ARE IN MILLIMETERS.
(Ø0.25)
Cu PAD
FOR DIMENSIONS D, E, X, AND Y SEE
DATUM C, THE SEATING PLANE, IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
PRODUCT DATASHEET.
SAC405 ALLOY
ASME Y14.5M, 1994
RECOMMENDED LAND PATTERN (NSMD)
0.50
A1
0.332±0.018
0.50
1.00
(Ø0.35)
SOLDER MASK
OPENING
0.250±0.025
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