S25FL128P0XNFI001 Spansion Inc., S25FL128P0XNFI001 Datasheet - Page 46

• Manufacturer Part Number: S25FL128P0XNFI001
• Description: IC, FLASH, 128MBIT, 104MHZ, WSON-8
• Manufacturer: Spansion Inc.

Specifications of S25FL128P0XNFI001

• Memory Type: Flash
• Memory Size: 128Mbit
• Ic Interface Type: Serial, SPI
• Clock Frequency: 104MHz
• Supply Voltage Range: 2.7 To 3.6 V
• Memory Case Style: WSON
• No. Of Pins: 8
• Cell Type: NOR
• Density: 128Mb
• Access Time (max): 20ns
• Interface Type: Parallel/Serial-SPI
• Boot Type: Not Required
• Address Bus: 1b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: WSON
• Program/erase Volt (typ): 2.7 to 3.6V
• Sync/async: Async/Sync
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 1b
• Number Of Words: 128M
• Supply Current: 22mA
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

20. Physical Dimensions
20.1
46
PACKAGE
SYMBOL
JEDEC
SO3 016 wide—16-pin Plastic Small Outline Package (300-mil Body Width)
A1
A2
E1
b1
c1
L1
L2
θ1
θ2
A
D
E
N
b
c
e
L
h
θ
SO3 016 (inches)
0.093
0.004
0.081
0.012
0.011
0.008
0.008
0.016
0.10
MIN
MS-013(D)AA
0˚
5˚
0.406 BSC
0.406 BSC
0.295 BSC
.050 BSC
.055 REF
.010 BSC
16
0˚
0.104
0.012
0.104
0.020
0.019
0.013
0.012
0.050
MAX
0.30
15˚
8˚
MIN
2.35
0.10
2.05
0.31
0.27
0.20
0.20
0.40
0.25
0˚
5˚
SO3 016 (mm)
1.40 REF
0.25 BSC
MS-013(D)AA
1.27 BSC
10.30 BSC
10.30 BSC
7.50 BSC
16
0˚
MAX
2.65
0.30
2.55
0.51
0.48
0.33
0.30
1.27
0.75
15˚
8˚
S25FL128P
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
NOTES:
.
D a t a
ALL DIMENSIONS ARE IN BOTH INCHES AND MILLMETERS.
DIMENSIONING AND TOLERANCING PER ASME Y14.5M - 1994.
DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 mm
PER END. DIMENSION E1 DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 mm PER SIDE. D AND E1
DIMENSIONS ARE DETERMINED AT DATUM H.
THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE
BOTTOM. DIMENSIONS D AND E1 ARE DETERMINED AT THE
OUTMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF
MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD
FLASH. BUT INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
DATUMS A AND B TO BE DETERMINED AT DATUM H.
"N" IS THE MAXIMUM NUMBER OF TERMINAL POSITIONS FOR
THE SPECIFIED PACKAGE LENGTH.
THE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD
BETWEEN 0.10 TO 0.25 mm FROM THE LEAD TIP.
DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.10 mm TOTAL
IN EXCESS OF THE "b" DIMENSION AT MAXIMUM MATERIAL
CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE
LOWER RADIUS OF THE LEAD FOOT.
THIS CHAMFER FEATURE IS OPTIONAL. IF IT IS NOT PRESENT,
THEN A PIN 1 IDENTIFIER MUST BE LOCATED WITHIN THE INDEX
AREA INDICATED.
LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED
FROM THE SEATING PLANE.
S h e e t
S25FL128P_00_08 September 8, 2009
3601 \ 16-038.03 \ 8.31.6