PIC24FJ256GB106-I/MR Microchip Technology, PIC24FJ256GB106-I/MR Datasheet - Page 296

• Manufacturer Part Number: PIC24FJ256GB106-I/MR
• Description: IC, 16BIT MCU, PIC24F, 32MHZ, QFN-64
• Manufacturer: Microchip Technology
• Series: PIC® 24Fr

Specifications of PIC24FJ256GB106-I/MR

• Controller Family/series: PIC24
• No. Of I/o's: 51
• Ram Memory Size: 16KB
• Cpu Speed: 32MHz
• No. Of Timers: 5
• Core Size: 16 Bit
• Program Memory Size: 256KB
• Peripherals: ADC, Comparator, PWM, RTC, Timer
• Core Processor: PIC
• Speed: 32MHz
• Connectivity: I²C, SPI, UART/USART, USB OTG
• Number Of I /o: 51
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-VFQFN, Exposed Pad
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 52
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARD
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC24FJ256GB110 FAMILY
28.1
FIGURE 28-1:
TABLE 28-1:
TABLE 28-2:
DS39897B-page 294
PIC24FJ256GB110 family:
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 14x14x1 mm TQFP
Package Thermal Resistance, 12x12x1 mm TQFP
Package Thermal Resistance, 10x10x1 mm TQFP
Note 1:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
For frequencies between 16 MHz and 32 MHz, F
Note 1:
DC Characteristics
P
P
INT
I
/
O
Junction to ambient thermal resistance, Theta-
= Σ ({V
= V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
When the voltage regulator is disabled, V
V
x (I
DD
DDCORE
3.00V
2.75V
2.50V
2.25V
2.00V
PIC24FJ256GB110 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
DD
– V
Characteristic
– Σ I
OH
} x I
≤ V
Rating
OH
DD
OH
)
16 MHz
) + Σ (V
≤ 3.6V.
OL
x I
OL
Preliminary
PIC24FJXXXGB1XX
)
Frequency
MAX
JA
DD
(θ
= (64 MHz/V) * (V
JA
and V
) numbers are achieved by package simulations.
Symbol
Symbol
P
DDCORE
DMAX
θ
θ
θ
P
T
T
JA
JA
JA
A
D
J
must be maintained so that
DDCORE
50.0
69.4
76.6
Min
Typ
-40
-40
(T
© 2008 Microchip Technology Inc.
P
32 MHz
– 2V) + 16 MHz.
J
INT
– T
Max
Typ
—
—
—
—
—
+ P
A
)/θ
2.75V
2.25V
I
/
O
JA
°C/W
°C/W
°C/W
+125
Max
Unit
+85
(Note 1)
(Note 1)
(Note 1)
Notes
Unit
°C
°C
W
W