FYP1004DNTU Fairchild Semiconductor, FYP1004DNTU Datasheet

DIODE SCHOTTKY 40V 10A TO-220

FYP1004DNTU

Manufacturer Part Number
FYP1004DNTU
Description
DIODE SCHOTTKY 40V 10A TO-220
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of FYP1004DNTU

Voltage - Forward (vf) (max) @ If
670mV @ 10A
Current - Reverse Leakage @ Vr
1mA @ 40V
Current - Average Rectified (io) (per Diode)
10A
Voltage - Dc Reverse (vr) (max)
40V
Diode Type
Schottky
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Diode Configuration
1 Pair Common Cathode
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Product
Schottky Diodes
Peak Reverse Voltage
40 V
Forward Continuous Current
10 A
Max Surge Current
80 A
Configuration
Dual Common Cathode
Forward Voltage Drop
0.67 V
Maximum Reverse Leakage Current
1000 uA
Operating Temperature Range
- 65 C to + 150 C
Mounting Style
Through Hole
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FYP1004DNTU
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
Updated process quality documentation, such as FMEAs and Control Plans, are available for
viewing upon request.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Sun, Brian
E-mail: Brian.Sun@fairchildsemi.com
Phone:
Implementation of change:
Expected 1st Device Shipment Date: 2008/01/29
Earliest Year/Work Week of Changed Product: 0805
Change Type Description: Lead Frame Dimensions (Internal and External)
Description of Change (From): Current TO-220 heatsink and die attach pad thickness of
1.30mm.
Description of Change (To): New TO-220 heatsink and die attach pad thickness will be
0.51mm. There is no change in heatsink and die attach pad material. Conversion of heatsink
thickness will be done on a part by part basis starting WW05 of 2008 to prevent mixing of
product with different heat sink dimensions in shipments during the transition period.
Reason for Change : Enhancement of leadframe design to improve package mechanical
performance and support additional demand for various TO-220 products to improve our
service to customers. There is insignificant difference in product thermal performance.
Qual/REL Plan Numbers : Q20070208
Qualification :
Passed and meet the FSC rel performance requirement
Change From
DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL
Technical Contact:
Name: LEE, SANGDO
E-mail: SANGDO.LEE@fairchildsemi.com
Phone: 86-512-6762-3311 ext 8671
Date Issued On : 2007/11/29
Date Created : 2007/11/16
PCN# : Q3073802-A
Pg. 1

Related parts for FYP1004DNTU

FYP1004DNTU Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

Change To Pg. 2 ...

Page 3

Results/Discussion Test: (Autoclave) Lot Device Q20070208AAACLV MC78T12CT Q20070208BAACLV KA350TU Q20070208CAACLV KSE13003TH2ATU Q20070208DAACLV KSE13009TU Q20070208EAACLV FJP5027RTU_F080 Test: (High Temperature Reverse Bias) Lot Device Q20070208CAHTRB KSE13003TH2ATU Q20070208DAHTRB KSE13009TU Q20070208EAHTRB FJP5027RTU_F080 Test: (High Temperature Storage Life) Lot Device Q20070208AAHTSL MC78T12CT Q20070208BAHTSL KA350TU Q20070208CAHTSL ...

Page 4

Test: (Temperature Humidity Biased Test) Lot Device Q20070208AATHBT MC78T12CT Q20070208BATHBT KA350TU Q20070208CATHBT KSE13003TH2ATU Q20070208DATHBT KSE13009TU Q20070208EATHBT FJP5027RTU_F080 Test: -65C, 150C (Temperature Cycle) Lot Device Q20070208AATMCL1 MC78T12CT Q20070208AATMCL1 MC78T12CT Q20070208BATMCL1 KA350TU Q20070208BATMCL1 KA350TU Q20070208CATMCL1 KSE13003TH2ATU Q20070208CATMCL1 KSE13003TH2ATU Q20070208DATMCL1 KSE13009TU Q20070208DATMCL1 KSE13009TU ...

Page 5

... KSD288YTU BDX53ATU BDX53CTU BDX53TU BDX54C BU406 BU407HTU BU806 BUT11 BUT11TU BUT12TU FJP13007H1TU FJP13007H2TU_F080 FJP13009H2TU FJP3305 FJP3305TU FJP5027RTU_F080 FJP5304DTU_F080 FJP5554 FJP5555TU_NL FYP1004DNTU_NL FYP1045DNTU FYP2004DNTU FYP2010DNTU KSA1010OTU KSA1010YTU KSA614R KSA614YTU KSA940H2 KSB546O KSB596O KSB596YTU KSB601YTU KSB707RTU KSB708RTU KSB834Y KSC1507OTU KSC1507YTU KSC2073H2 KSC2233 KSC2334RTU ...

Page 6

KSD362R KSD363OTU KSD363Y KSD401G KSD401YTU KSD526Y KSD560OTU KSD560Y KSD568RTU KSD569RTU KSD73Y KSD880OPATU KSE13009TU KSE3055T KSE44H11 KSE45H11TU MBR3030CTTU MBRP3010NTU MBRP3045NTU_F080 MJE2955TTU_NL TIP102 TIP105 TIP107 TIP110TU TIP112 TIP115TU TIP120 TIP121TU TIP122TU_NL TIP125TU TIP127 TIP142TTU TIP29 TIP29C TIP30C TIP31A TIP31C TIP32A TIP32C TIP41A ...

Related keywords